The Holistic Approach to Materials and Processing for New and Scaled Devices

Taking a holistic approach to materials integration considering the subtle effects of seemingly simple materials challenges is required to ensure performance, yield, reliability, and overall cost of ownership.

Examining Chip Manufacturing Challenges for Advanced Logic Architecture

A look at the critical issues that will have to be addressed to cost-effectively produce the next generation of faster, denser chips.

Chasing IC Yield when Every Atom Counts

Increasing fab costs coming for inspection and metrology At SEMICON West this year in Thursday morning’s Yield Breakfast sponsored by Entegris, top executives from Qualcomm, GlobalFoundries, and Applied Materials discussed the challenges to achieving profitable fab yield for atomic-scale devices…