Cross-point ReRAM Integration Claimed by Intel/Micron

The Intel/Micron joint-venture now claims to have successfully integrated a Resistive-RAM (ReRAM) made with an unannounced material in a cross-point architecture, switching using an undisclosed mechanism. Pilot production wafers are supposed to be moving through the Lehi fab, and samples…

Batteries? We don’t need no stinking batteries.

We’re still used to thinking that low-power chips for “mobile” or “Internet-of-Things (IoT)” applications will be battery powered…but the near ubiquity of lithium-ion cells powering batteries could be threatened by capacitors and energy-harvesting circuits connected to photovoltaic/thermoelectric/piezoelectric micro-power sources. At…

Oscar for DMD Inventor Hornbeck

Kudos to Dr. Larry J. Hornbeck, the extended team at Texas Instruments (TI) that has worked on Digital Micromirror Device (DMD) technology, and to the TI executives who continued to fund the R&D through years of initial investment losses. Hornbeck…

Micro-Buckled 3D Silicon Scaffolds

A new silicon microstructural solution announced this month is so powerful in creating 3D patterns from 2D surface machining that I just have to share. The figure shows 3D silicon microstructures formed by compressive buckling. The method can be used…

ASML Books Production EUV Orders

TSMC commits to two tools for delivery next year Maybe, just maybe, ASML Holding N.V. (ASML) has made the near-impossible a reality by creating a cost-effective Extreme Ultra-Violet (EUV @ ~13.5nm wavelength) all-reflective lithographic tool. The company has announced that…

Nakamura Co-Wins Nobel for Blue LEDs

The Nobel Prize in Physics 2014 was awarded jointly to Isamu Akasaki, Hiroshi Amano, and Shuji Nakamura “for the invention of efficient blue light-emitting diodes which has enabled bright and energy-saving white light sources”. In the late 1980s red and…

IBM Shows Graphene as Epi Template

Last month in Nature Communications (doi:10.1038/ncomms5836) IBM researchers Jeehwan Kim, et al. published “Principle of direct van der Waals epitaxy of single-crystalline films on epitaxial graphene.” They show the ability to grow sheets of graphene on the surface of 100mm-diameter…

Chasing IC Yield when Every Atom Counts

Increasing fab costs coming for inspection and metrology At SEMICON West this year in Thursday morning’s Yield Breakfast sponsored by Entegris, top executives from Qualcomm, GlobalFoundries, and Applied Materials discussed the challenges to achieving profitable fab yield for atomic-scale devices…

Moore’s Law is Dead – (Part 4) Why?

We forgot Moore merely meant that IC performance would always improve (Part 4 of 4) IC marketing must convince customers to design ICs into electronic products. In 1965, when Gordon Moore first told the world that IC component counts would…