Mid-Infrared Optical Metrology for High Aspect Ratio Holes in 3D NAND Manufacturing

Infrared critical dimension metrology (IRCD) addresses the shortcomings of conventional ultraviolet to near-infrared OCD in channel hole etch high-fidelity z-profile and amorphous carbon hardmask etch BCD metrology.

New Drivers Propelling Semis, Equipment, IP

The shortage of semiconductors won’t be easy to solve, with some equipment lead times stretching out several years, said VLSI Research CEO Dan Hutcheson at a SEMI event.

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