ASM’s Haukka ALD Award

Dr. Suvi Haukka, executive scientist at ASM International, located in Finland, was awarded the ALD Innovation prize at the ALD 2016 Ireland conference (Figure), as chosen by the conference chairs. Haukka has had a lifetime career in Atomic Layer Deposition…

Eloquent Executives Ecosystem Expositions

#cmc,#confab,#namedropping With dimensional scaling reaching economic limits, each company in the IC fab industry must rely upon trusted connections with customers and suppliers to know which way to go, and the only way to gain trusted connections is through attending…

SAQP Specs for 7nm finFETs

As discussed in my last Ed’s Threads, lithography has become patterning as evidenced by first use of Self-Aligned Quadruple Patterning (SAQP) in High Volume Manufacturing (HVM) of memory chips. Meanwhile, industry R&D hub imec has been investigating use of SAQP…

Litho becomes Patterning

Once upon a time, lithographic (litho) processes were all that IC fabs needed to transfer the design-intent into silicon chips. Over the last 10-15 years, however, IC device structural features have continued to shrink below half the wavelength of the…

ALD of Crystalline High-K SHTO on Ge

Alternative channel materials (ACM) such as germanium (Ge) will need to be integrated into future CMOS ICs, and one part of the integration was shown at the recent Materials Research Society (MRS) spring meeting by John Ekerdt, Associate Dean for…

CMP Slurry Trade-offs in R&D

As covered at SemiMD.com, the CMP Users Group (of the Northern California Chapter of The American Vacuum Society) recently held a meeting in Albany, New York in collaboration with CNSE, SUNY Polytechnic Institute, and SEMATECH. Among the presentations were deep…