I’m Boldly Going to Medlab in Search of the Fabled Tricorder

While the Star Trek tricorder remains the stuff of science fiction, diagnostics companies globally continue to beaver away behind the scenes in search of a machine capable of diagnosing the highest number of possible conditions within a single technology.

Heterogeneous Integration: Expert Panel Addresses the Challenges Ahead

At SEMICON West, Applied Materials hosted a panel of experts that focused on emerging trends in heterogeneous design and integration using advanced packaging technology.

Scaling Progress Takes Many Paths at VLSI Symposium

The IEEE 2022 Symposium on VLSI Technology and Circuits attracted 650 people to attend in person in Honolulu, and an equal number of virtual attendees.

Join Us at The ConFab 2018

The ConFab 2018, to be held May 20-23 at The Cosmopolitan of Las Vegas, is a conference and networking event designed to inform and connect leading semiconductor executives from all parts of the supply chain.

Chasing IC Yield when Every Atom Counts

Increasing fab costs coming for inspection and metrology At SEMICON West this year in Thursday morning’s Yield Breakfast sponsored by Entegris, top executives from Qualcomm, GlobalFoundries, and Applied Materials discussed the challenges to achieving profitable fab yield for atomic-scale devices…

Extreme Stress for Existing Foundry/Fabless Model

The increased performance and the rapid shift from traditional handsets to consumer computing device post a number of manufacturing and supply chain challenges for fabless chip makers. The scale of the challenges also creates an “extreme stress” for the existing foundry/fabless model to defend its excellence in this dynamic landscape. Qualcomm’s Dr. Roawen Chen will discuss headwinds and opportunities in a keynote talk at The ConFab.

Qualcomm’s Dr. Roawen Chen to keynote at The ConFab

I’m delighted to report that Dr. Roawen Chen, Senior Vice Present of global operations at Qualcomm, has accepted our invitation to deliver the keynote talk at The ConFab, on Monday June 23rd.

High cost per wafer, long design cycles may delay 20nm and beyond

Handel Jones, founder and CEO of International Business Strategies (IBS), spoke at SEMI’s Industry Strategy Symposium last week, focusing on key trends, factors impacting the growth of the industry and the migration to smaller feature dimensions. He is bullish about 2014 and industry innovation, but cautious about how quickly the industry will move to new technology nodes due to higher costs, and long design cycles.