Mitigation of Pattern Collapse in EUVL

Rinse materials offer benefits of pattern collapse mitigation and defect improvement and, therefore, superior process margins for yield improvement. Defectivity is also significantly improved with an EUV rinse.

Trefonas Earns 2016 Perkin Medal

The Society of Chemical Industry (SCI), America Group, announced on May 5, 2016 that Peter Trefonas, Ph.D., corporate fellow in Electronic Materials at Dow Chemical Co (NYSE:DOW), has won the 2016 SCI Perkin Medal. This honor recognizes Trefonas’ contributions in…

SAQP Specs for 7nm finFETs

As discussed in my last Ed’s Threads, lithography has become patterning as evidenced by first use of Self-Aligned Quadruple Patterning (SAQP) in High Volume Manufacturing (HVM) of memory chips. Meanwhile, industry R&D hub imec has been investigating use of SAQP…

Litho becomes Patterning

Once upon a time, lithographic (litho) processes were all that IC fabs needed to transfer the design-intent into silicon chips. Over the last 10-15 years, however, IC device structural features have continued to shrink below half the wavelength of the…

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