Panel-Level Heterogeneous Integration Technology for Analog ICs

Micro-transfer printing, a massively parallel pick-and-place process, may be used to produce HI analog ICs comprised of large arrays of ultra-thin separately manufactured components interconnected using redistribution layer technology.

Apple Fab Speculation

Apple Corp. recent purchased an old 200mm-diameter silicon wafer fab in San Jose capable of creating as small as 90nm device features. Formerly owned and operated by Maxim, the US$18.2M purchase reportedly includes nearly 200 working fab tools. Some people…