Emerging Vacuum Challenges Posed by New Materials and Cluster Tool Architectures

New processes and materials pose many challenges for supporting vacuum equipment. Intelligent design choices can address these challenges.

Harsh New Processes and Materials Pose Challenges for Vacuum Systems

Maximizing the productivity and profitability of the semiconductor manufacturing process requires pump designs that are optimized for the application, especially harsh applications that use condensable or corrosive gases.

Innovative Approaches to Vacuum Enable High-Volume Atomic Layer Processing

Processes such as atomic layer deposition and etch require fast, repetitive, complete exchange of gases in the process chamber. Vacuum equipment manufacturers have responded with solutions that address the challenges presented by these high flow applications.