TECHCET forecasts a nearly 10% increase in revenue for semiconductor plating chemicals in 2025, reaching an estimated $1.19 billion. This growth is driven by increased adoption of advanced packaging technologies (including Cu pillar, uBump, RDL, and TSV), alongside scaling demands in leading-edge logic and memory devices. Over the next five years, the overall plating chemicals market is expected to grow at a 7.1% CAGR as detailed in TECHCET’s Critical Materials Report™ on Metal Chemicals for FE and Advanced Packaging.
The global semiconductor plating chemicals revenues reached $1.08 billion in 2024, representing 4.4% growth over 2023. Of this, $655 million came from copper plating chemicals used in device-level interconnects within the wafer, while $429 million was generated from advanced packaging applications. Within packaging, $83 million came specifically from copper plating. Growth in 2024 was moderated by lingering supply chain and inventory corrections, but demand remained resilient across logic, DRAM, and NAND applications.
Looking ahead, rising wafer output and the proliferation of advanced logic nodes are fueling demand for complex interconnect structures. The industry is seeing broader adoption of buried power rails and backside Cu wiring, particularly in AI and HPC applications. Key suppliers like MacDermid have made notable gains in the advanced packaging space, driven by alignment with fabs and plating tool OEMs to deliver differentiated additives. China’s domestic market is also creating competitive shifts, with companies like Sinyang gaining share among OSATs. Meanwhile, CHIPS Act funding is catalyzing investment in domestic capacity. However, geopolitical tensions and tariff uncertainties may increase costs, incentivizing further localization of supply chains and custom material solutions.
