The Real Reason Behind the Automotive Industry IC Shortage — A Step-Function Surge in Demand

After years of moderate increases, IC suppliers blindsided by automotive IC demand spike in 2021.

SEMI Applauds House Introduction of America COMPETES Act of 2022 with Funding for CHIPS Act

SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the introduction of the America Competes Act of 2022 in the United States House of Representatives.

ACM Research Strengthens Wet Processing Portfolio with New Compound Semiconductor Tools

ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its comprehensive tool set to support compound semiconductor manufacturing.

SRC and NSF to Support Semiconductor Research Experiences for Undergraduates

The U.S. National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) recently signed a memorandum of understanding to support hands-on research opportunities for undergraduate students in technical areas related to semiconductors.

JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard.

NucleiSys Adopts Breker’s System Coherency TrekApp

Breker Verification Systems announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and 64-bit RISC-V processor intellectual property (IP) designs.

SmartDV and NSITEXE Sign Agreement

SmartDV Technologies, a supplier of Design and Verification Intellectual Property (IP), and NSITEXE, developer of advanced processors, today signed a multi-year agreement that enables SmartDV to license NSITEXE’s recently announced RISC-V-based, 32-bit CPU core to its customers.

America COMPETES Act of 2022 Is a Much-Needed Bill, but Not Sufficient to Compete with China, Says ITIF

Following the introduction of the America COMPETES Act of 2022 from the House of Representatives, companion legislation to the U.S. Innovation and Competition Act (USICA), which passed the Senate last June, the Information Technology and Innovation Foundation (ITIF), the leading think tank for science and technology policy, released the following statement.

CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets

CEVA, Inc. announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution.

Wooptix Introduces a Patterned Wafer Geometry System for 300mm Silicon Wafers

Wooptix SL will be presenting a new technique for Patterned Wafer Geometry at the upcoming SPIE Advanced Lithography conference on February 28th, 2022, in a paper published together with Applied Materials.

North American Semiconductor Equipment Industry Posts December 2021 Billings

After record-breaking billings of North America-based semiconductor equipment manufacturers in November 2021, December billings remained robust and were the second-highest ever.

Asymmetry is Key to Creating More Stable Blue Perovskite LEDs

For the first time, researchers have created blue LEDs using layers of metal halide perovskite linked with asymmetrical bridges, solving a critical instability problem.

SPIE and the University of Rochester Announce $1 Million Optics Graduate Fellowship

SPIE, the international society for optics and photonics, and the University of Rochester have announced the establishment of the SPIE Graduate Fellowship in Optical Sciences and Engineering.

Top Tier Semiconductor Supplier Qualifies Veeco’s Wet Processing System for Next Generation High Bandwidth Memory Applications

Veeco Instruments Inc. today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM).

SEMI Industry Strategy Symposium Europe to Spotlight Environmental Sustainability, Social Responsibility and Supply Chain Resilience

SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium, May 30, with insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry.

Kandou Expands into Silicon Glen

Kandou, a developer in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, officially opened its Silicon Glen office in East Kilbride, Scotland, today.

Weebit Nano Demonstrates Its First Crossbar ReRAM Arrays

Weebit Nano Limited, a  developer of next-generation memory technologies for the global semiconductor industry, announced that together with its development partner CEA-Leti, it has demonstrated its first operational crossbar arrays, a key milestone on the Company’s path to creating discrete (stand-alone) non-volatile memory (NVM) chips.

EV Group Recognized by Bosch as a Preferred Supplier of Semiconductor Equipment

EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status.

Addressing the Microchip Shortage

This country’s semiconductor chip shortage is likely to continue well into 2022, and a Georgia Tech expert predicts that the U.S. will need to make major changes to the manufacturing and supply chain of these all-important chips in the coming year to stave off further effects.

Harnessing Noise in Optical Computing for AI

A research team led by the University of Washington has developed new optical computing hardware for AI and machine learning that is faster and much more energy efficient than conventional electronics.

IC Sales Seen Growing by Double-Digits for Third Year in a Row

First three-year period of double-digit gains in 25 years, based on IC Insights’ forecast.

Trio-Tech Resumes Operations at Tianjin City Facility

Trio-Tech International today announced that it has resumed full operations at the Company’s Tianjin, China, facility.

Amcor Announces Strategic Investment in PragmatIC Semiconductor

In its continuing efforts to discover and develop innovative technologies for the packaging industry, Amcor announced today its strategic investment in PragmatIC Semiconductor.

CyberOptics — Live from SEMICON West 2021

CyberOptics’ new WX3000 Metrology and Inspection system, which Incorporates the company’s NanoResolution Multi-Reflection Suppression™ (MRS™) sensor, enables the combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging. At SEMICON West, Subodh Kulkarni, President and CEO, explains how it works and what’s new in the company’s other product lines.

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