CEA-Leti to Present Latest Results & Insights on 3D Technologies, Power Electronics & Quantum Computing at IEDM 2020

CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.

CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.

Institute scientists are lead authors on four papers and contributing authors on five more that will be presented during the conference. Two of the four CEA-Leti papers discuss 3D technologies:

The other two CEA-Leti papers report work in GaN-on-SI and power electronics:

In addition, CEA-Leti will present a tutorial on quantum technology, which will be on demand starting on Saturday, Dec. 5.

Tutorial 1:  Quantum Computing Technologies, by Maud Vinet

The tutorial will include a recap of quantum computing principles and will identify the qubit figures of merit required to build a quantum processor. It also will benchmark the experimental platforms and provide a system perspective on the challenges of reaching high numbers of qubits, e.g. more than 10,000.

A live Q&A will be held on Saturday, Dec. 12, from 8:00 to 8:45 am PST.

CEA-Leti will also host a Short Course on 3D Integration, which will be on demand starting on Sunday, Dec. 6.

Short Course Session 1:  “3D sequential integration: opportunities, breakthroughs and challenges,” by Claire Beranger-Fenouillet

A live Q&A will be held on Sunday, Dec. 13 from 8 to 9 am PST

For more information about IEDM and to register, click here.

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