Semiconductors

Eurex Launches Futures Contract on Semiconductor Industry

Eurex, Europe’s leading derivatives exchange, is expanding its suite of sector index futures.

Semiconductor Assembly and Test Facility Database Now Tracks OSAT and Integrated Device Manufacturers in 670 Facilities

New edition of SEMI’s database tracks 33% more facilities and highlights advanced packaging and factory certifications.

Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System

LA9300AD enables detection of shallow microscopic defects, contributing to reduced manufacturing costs and improved yield.

Adeia Chooses Veeco to Accelerate Next-Generation Advanced Packaging Applications

Veeco Instruments Inc. today announced that Adeia Inc., a semiconductor R&D innovator has chosen the WaferStorm Wet Processing Systems for advanced packaging applications.

Global Semiconductor Materials Market Set to Achieve Record Highs

TECHCET forecasts a rebound in the global semiconductor materials market this year.

Intel Appoints Stacy Smith to Board of Directors

Intel Corporation today announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.

What’s in the March Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.

SemiQon Announces Shipping of its Silicon-Based 4-qubit Quantum Chip and Transistors

Research groups around the world are now using these first-generation silicon-based chips helping the industry step faster to the million qubit level of quantum computing.

Brooks Instrument Introduces New Mass Flow Controllers for High-Temperature Environments

Brooks Instrument has released its new GF120xHT Series high-temperature thermal mass flow controller.

Silicon Box Announces $3.6B Investment For Expansion Into Italy

Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility.

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