AI

Researchers Develop Device to Make Artificial Intelligence More Energy Efficient

Energy consumption from artificial intelligence could be reduced by a factor of at least 1,000 with this device.

Fractile Raises $15M Seed Funding

Fractile, a UK company building a groundbreaking new AI chip to deliver exponential performance improvements for AI models, has today exited stealth and announced $15m (£12m) in seed funding.

Analog Devices and Flagship Pioneering Announce Strategic Partnership

Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Flagship Pioneering, the bioplatform innovation company, today announced a strategic alliance to accelerate the development of a fully digitized biological world.

IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees

2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.

SiMa.ai and Ortecs Announce Agreement to Deliver Edge AI Technology in Israel

Through its partnership with SiMa.ai, Ortecs will expand its portfolio and provide its customers and the market in Israel with a new artificial intelligence offering.

Lam Research Appoints Ava Harter as Chief Legal Officer

Lam Research Corp. today announced that Ava Harter has joined its executive leadership team as senior vice president and chief legal officer.

Nanotronics Unveils Gen V AI Model and Two New, Affordable Inspection Products

Nanotronics is set to redefine industry standards with the introduction of its next generation AI, and two new hardware products that leverage it.

JEDEC Approaches Finalization of HBM4 Standard

JEDEC Solid State Technology Association today announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.

AEM Introduces the New Generation of Automated Burn-In Systems for AI and High Performance Compute Chip Testing

AEM announced today the launch of a new burn-in capability for its high-parallel test platform, AMPS.

Technology Communications Trio Speed AI-Ready U.S. Workforce

MediaMobz,  Hill + Kincaid PR and OuthinkAI announced today a strategic partnership to accelerate an AI-ready U.S. semiconductor workforce.

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