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Pragmatic Semiconductor Appoints Murthy Renduchintala to Board of Directors

Semiconductor veteran joins the FlexIC technology pioneer enabling sustainable item-level intelligence in trillions of devices over the next decade.

Micron Introduces the World’s Fastest Data Center SSD

Micron Technology, Inc. today announced availability of the Micron 9550 NVMe SSD – the world’s fastest data center SSD and industry leader in AI workload performance and power efficiency.

Lam Research Appoints Ava Harter as Chief Legal Officer

Lam Research Corp. today announced that Ava Harter has joined its executive leadership team as senior vice president and chief legal officer.

Carrie Esko Joins SIA Team

The Semiconductor Industry Association (SIA) today announced Carrie Esko has joined the SIA team. Esko will serve as director of global policy for trade and supply chain matters.

Advanced Energy Unveiled New Smart Monitoring and Digital Control Capabilities for AC-DC High Power Supplies

Advanced Energy has unveiled a new hardware accessory for its ultra-efficient, high-power suppliers. AE’s PowerPro Dongle unlocks real-time powerful monitoring, control and diagnostics capabilities for designers.

EtherCAT Technology Group’s Semiconductor Working Group Hosts 25th Meeting in Silicon Valley

In addition to the regular work on profiles for the semiconductor industry, the group also took time to look back on the successes of the working group since it was founded in 2011.

Biden-Harris Administration Announces Preliminary Terms with GlobalWafers

The proposed CHIPS investment would support the construction of new wafer manufacturing facilities and the creation of 1,700 construction jobs and 880 manufacturing jobs.

Wafer Fab Equipment: 2024 Revenue Holds Steady, Poised for 2025 Surge

Yole Group announces a 2024 revenue (calendar year) to increase by 1.3% year-on-year, reaching $108.1 billion, despite a 12% quarter-to-quarter drop in Q1 2024.

Intel Launches Its First US Apprenticeship for Manufacturing Facility Technicians

The program will train facility technician apprentices over the next five years in Arizona.

Adeia Wins ECTC Award for Paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”

Adeia Inc. was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024. 

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