Packaging

TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production

NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC, the global association for electronics manufacturing, as its chief strategist for advanced packaging.

UMass Amherst Researchers Join $26M Quantum Computing Effort to Build Internet of the Future

UMass is leading the core effort to design architectures and protocols for quantum networking for the National Science Foundation’s Center for Quantum Networks.

Weebit Nano to Demo its ReRAM Technology on GlobalFoundries’ 22FDX Platform

Weebit Nano Limited will showcase a live demo of Resistive Random-Access Memory (ReRAM) technology implemented in GlobalFoundries’ 22FDX platform.

HiPace 30 Neo: Smallest Hybrid-Bearing High-Power Turbopump on the Market

The new HiPace 30 Neo turbopump from Pfeiffer Vacuum is a vacuum pump for compact analysis systems and portable applications.

Semiconductor Assembly and Test Facility Database Now Tracks OSAT and Integrated Device Manufacturers in 670 Facilities

New edition of SEMI’s database tracks 33% more facilities and highlights advanced packaging and factory certifications.

Toray Develops Hybrid Bonding Resin for Enhancing Yield and Reliability in Semiconductor Packaging

Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding).

Adeia Chooses Veeco to Accelerate Next-Generation Advanced Packaging Applications

Veeco Instruments Inc. today announced that Adeia Inc., a semiconductor R&D innovator has chosen the WaferStorm Wet Processing Systems for advanced packaging applications.

Global Semiconductor Materials Market Set to Achieve Record Highs

TECHCET forecasts a rebound in the global semiconductor materials market this year.

Adeia Presents Metrology Techniques for Improved Yield in Hybrid Bonding at IMAPS Device Packaging Conference 2024

Adeia Inc. will showcase the latest developments in hybrid bonding technology at the 20th Annual Device Packaging Conference (DPC 2024) on March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona

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