Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced that its easy to use Lattice Diamond FPGA design and verification software environment (version 3.10 Service Pack 3) is certified ascompliant with the IEC 61508 and ISO 26262 functional safety standards. These standards are widely used by developers in automotive and industrial applications, as OEMs require mission-critical systems used in their industrial control equipment and vehicles to deliver highly reliable performance with minimal system failures.
Packaging
North American Semiconductor Equipment Industry Posts December 2019 Billings
North America-based manufacturers of semiconductor equipment posted $2.49 billion in billings worldwide in December 2019 (three-month average basis), according to the December Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 17.5 percent higher than the final November 2019 level of $2.12 billion, and is 17.8 percent higher than the December 2018 billings level of $2.11 billion.
USMCA Approval Strengthens U.S. Technology and Trade Leadership
The Semiconductor Industry Association (SIA) today applauded Senate approval of the U.S.-Mexico-Canada Agreement (USMCA), which passed with strong bipartisan support earlier today. SIA represents U.S. leadership in semiconductor manufacturing, design, and research, with members accounting for approximately 95 percent of U.S. semiconductor company sales. “Congressional approval of the USMCA is a major win for free trade and America’s global leadership in semiconductors and the technologies they enable,” said John Neuffer, SIA president and CEO. “The agreement will help ensure that more products researched, designed, and made in America – including semiconductors – can flow to customers around the world. We applaud the Administration and Congress for negotiating and approving this landmark agreement.”
Synopsys Joins New Autonomous Vehicle Computing Consortium
Synopsys, Inc. (Nasdaq: SNPS) today announced that it has joined the new Autonomous Vehicle Computing Consortium. The Consortium brings together leading experts in the automotive, automotive supply, semiconductor and computing industries to help accelerate the delivery of safer and affordable vehicles. As a member of the Consortium, Synopsys will actively contribute to the development of a set of recommendations for system architectures and computing platforms that will be used to address the challenges of deploying self-driving vehicles at scale.
Synopsys’ John R. Rogers Named 2020 Recipient of the SPIE Rudolf and Hilda Kingslake Award
Synopsys, Inc. (Nasdaq: SNPS) today announced that Dr. John R. Rogers, principal engineer of imaging optics in the Optical Solutions Group at Synopsys, has been named the 2020 recipient of the SPIE Rudolf and Hilda Kingslake Award in Optical Design. SPIE, the international society for optics and photonics, presents the award in recognition of significant achievements in the field of optical design and optical engineering theory.
SEMI 3D & Systems Summit Keynotes Spotlight 5G, HPC and System-in-Package Innovations
Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch International will headline the event with keynotes. Event registration is open.
Nepes Is Now Supplying a Highly Reliable Fan-Out Package to a Leading Wireless Chip Maker
Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker. Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies. “High Reliability Fan-out Package,” supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Reliability) performance versus standard fan-out technologies by reducing physical stress on chips through sidewall protection structures.
Semiconductor Materials Growing to Nearly $50B Market in 2020 After Downturn
TECHCET—the electronic materials advisory services firm providing business and technology information— announced that global revenues for semiconductor manufacturing and packaging materials are expected to grow 5.7% year-over-year (YoY) in 2020 to US$49.5B, of which 65% represents semiconductor fab materials.
NY CREATES Begins Discussions on New Strategic Relationship With SEMI
The New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY CREATES) today announced discussions to form a new Strategic Engagement with SEMI, the global industry association representing the electronics manufacturing and design supply chain. The announcement was made at the SEMI Industry Strategy Symposium, attended by several hundred C-Level semiconductor executives. Formed as a new and flexible industry interface in New York, NY CREATES is tasked with bridging academic, research, and industry innovation of the advanced electronics sector in New York.
EV/HEV Is Driving Power Electronics Innovations
The power electronics sector is pushing to adapt and propose innovative products. Objectives are clearly to answer to the specific needs coming from EV/HEV makers and make sure, for the power electronics companies, to be part of this attractive growth. They are so working on the miniaturization of the components, circuits and system design and are developing new solutions to integrate several systems in one system (e-axle, integration of DC-DC converter with a battery, etc.). Of course, WBG technologies are part of the technology roadmap, especially SiC power devices.