CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.
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NY CREATES and JETRO Announce Strategic Partnership to Strengthen U.S.-Japan Collaboration in the Semiconductor Industry
NY CREATES and the Japan External Trade Organization (JETRO) today announced a strategic partnership to drive international collaboration in the semiconductor industry, highlighting a commitment to promoting advanced chips-related research and development, technology alliances, and workforce development across the high-tech ecosystems of New York’s Capital Region and Japan.
Destination 2D Brings Graphene to Mainstream CMOS
Destination 2D – a new semiconductor startup with unmatched expertise in graphene process technology – today announced it has successfully achieved wafer-scale synthesis of high-quality graphene within CMOS-compatible process conditions.
Global Semiconductor Alliance Announces the 2024 Recipients of the GSA Annual Awards
Last night, the Global Semiconductor Alliance (GSA) celebrated its 30th anniversary and the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala.
Smartkem Signs Multi-Year Agreement with FlexiIC to Develop a New Generation of CMOS for Smart Sensors
New project builds on ongoing collaboration to develop custom circuits using Smartkem’s organic transistor technology.
Intel Appoints Semiconductor Leaders Eric Meurice and Steve Sanghi to Board of Directors
Intel Corporation today announced that Eric Meurice, former president, chief executive officer and chairman of ASML Holding N.V., and Steve Sanghi, chairman and interim chief executive officer of Microchip Technology Inc., have been appointed to Intel’s board of directors, effective immediately.
YES Announces Release of VertaCure XP G3 Systems for Advanced Packaging Applications
YES announced today that it is releasing VertaCure XP G3 curing systems for production.
Soitec and GlobalFoundries Collaborate in the Production of High-Performance RF-SOI Semiconductors
Soitec announced today its commitment to deliver 300mm RF-SOI substrates to GlobalFoundries (GF) for the production of GF’s leading RF-SOI technology platforms, including the company’s most advanced RF solution, 9SW.
VSMC Celebrates Breaking Ground on 300mm Fab in Singapore
VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), the joint venture formed in September, 2024 by Vanguard International Semiconductor Corporation and NXP Semiconductors N.V. today celebrated breaking ground at the site of the joint venture’s new 300mm wafer manufacturing facility in Tampines, Singapore.
GlobalFoundries GaN Chip Manufacturing Advances with $9.5 Million U.S. Federal Funding
Funding moves GF closer to large-scale production of next-generation gallium nitride chips for a range of RF and high-power applications.
