Global semiconductor equipment billings surged 30% year-over-year and rose 16% to US$19.4 billion from the prior quarter, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
Revolutionary changes are happening in the advanced semiconductor packaging industry.
The STMicroelectronics L7983 is a compact, 3V-60V, 300mA synchronous DC/DC buck converter with flexible, dynamic-mode selection to satisfy noise-sensitive applications and maximize efficiency at light load.
Dialog Semiconductor plc, a provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial edge computing solutions today announced that AST & Science, LLC, a satellite company that is disruptively transforming satellite broadband access, has selected Dialog to develop four custom mixed-signal & RF ASICs for their SpaceMobile network.
Semiconductor test equipment supplier Advantest Corporation and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that they have jointly developed an advanced, fully-automated final-test cell system that improves overall equipment efficiency and quality in semiconductor test and packaging operations.
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024.
proteanTecs, a developer of Deep Data solutions for electronics’ health and performance monitoring, will present at the Taiwan Semiconductor Executive Summit (TSES), taking place in Hsinchu on December 1-2, 2020.
The Semiconductor Industry Association (SIA) Board of Directors today elected Bob Bruggeworth, President, CEO, and Director of Qorvo, as its 2021 Chair and Steve Mollenkopf, CEO and Director of Qualcomm Incorporated, as its 2021 Vice Chair.
Resistive switching memory devices offer several advantages over the currently used computer memory technology. Researchers from the MIPT Atomic Layer Deposition Lab have joined forces with colleagues from Korea to study the impact of electrode surface morphology on the properties of a resistive switching memory cell.
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its Ultra ECP 3d platform for conformally filled 3D through-silicon via (TSV) applications.