Intel has fallen behind in its ability to make commercially ready, leading-edge chips in sufficient volumes, opening the door to its main rivals, AMD and Nvidia, says GlobalData, a leading data and analytics company.
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that more than 20 of its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the July 30 lift off of NASA’s Mars 2020 Perseverance rover.
Teledyne Technologies is featuring a broad range of advanced RF & Microwave products and capabilities this week at the annual International Microwave Symposium, revamped into a ‘virtual’ online event this year due to the ongoing pandemic. Nine separate Teledyne brands currently deliver complex RF/MW solutions globally for the most demanding applications.
Pfeiffer Vacuum, one of the world’s leading providers of vacuum technology, has introduced the OmniStar and ThermoStar GSD 350 compact, portable benchtop analyzers for analyzing gases at atmospheric pressure.
With advanced materials a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2020), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain.
Eta Compute Inc., a company dedicated to delivering machine learning to low power IoT and edge devices using its revolutionary TENSAI Platform, announced its TENSAI Flow software.
pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its digital step attenuator (DSA) portfolio with two new high-performance DSAs, PE43610 and PE43614.
Tachyum Inc. today announced that its Prodigy Universal Processor has successfully completed software emulation testing across x86, ARM and RISC-V binary environments.
SEMI, Cadence, Mentor, a Siemens Business, and Synopsys today announced plans to jointly develop an industry-standard protocol to combat electronic design automation (EDA) software piracy, a growing and costly problem for software vendors and their users.
Analog Devices, Inc. (ADI) today announced its collaboration with Intel Corporation to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.