Packaging

Paving the Way for Smart Factories

Intel, EXOR International, TIM and JMA Wireless teamed together to build an end-to-end smart factory in Verona, Italy, as an example of the benefits of Industry 4.0 digitalization to manufacturers of all sizes.

ROHM Introduces Industry-first AC/DC Converter ICs in a Surface Mount Package with Built-in 1700V SiC MOSFET

ROHM Semiconductor today introduced the industry’s first AC/DC converter ICs with a built-in 1700V SiC MOSFET (BM2SC12xFP2-LBZ) in the TO263-7L package.

Winbond Unveils New 1.8V 512Mb SPI NOR flash for 5G and Other High-End Server Applications

Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash.

IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24%

Global IC market expected to exceed $500 billion for the first time.

Alliance Memory Moves Taiwan Office to Larger Facility to Accommodate Global Growth

To help accommodate its rapid global expansion while providing room for future growth, Alliance Memory has moved into a new building in Taiwan with twice the warehouse and office space of the company’s previous local facility.

Imec Reports First Electrical Demonstration of Integrated Forksheet Devices to Extend Nanosheets Beyond 2nm Technology Node

This week, at the 2021 Symposia on VLSI Technology and Circuits (VLSI 2021), imec demonstrates for the first time fully functional integrated forksheet field-effect transistors.

3D Semiconductor Packaging Market Growth Opportunities in the Forthcoming Years with Forecast to 2023

As per the latest report published by Market Research Future (MRFR), the global 3D semiconductor packaging market is likely to reach a valuation of USD 37,472.7 million by the end of 2023, reflecting a healthy growth rate.

Applied Materials Breakthrough in Chip Wiring Enables Logic Scaling to 3nm and Beyond

Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

NHanced Semiconductors Announces Dedicated High‑Volume Advanced Packaging Facility

NHanced Semiconductors is expanding the cleanroom of its North Carolina foundry to house a new high-volume line of advanced packaging (AP) equipment.

Hprobe Announces Breakthrough in High-Volume Testing for Automotive/Consumer Advanced 3D Magnetic Sensors

Hprobe today announced the demonstration of a new 3D magnetic generator design resulting in magnetic field accuracy of less than 5µT (5 microteslas) for wafer level probing of 3D angular magnetic sensors.

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