Argonne Scientists Use Quantum Computers to Simulate Quantum Materials
Scientists achieve important milestone in making quantum computing more effective.
Diamondx Selected for Internet of Things Semiconductor Test
Cohu, Inc. today announced a U.S. semiconductor manufacturer has selected the Diamondxplatform for testing their product portfolio.
GS Microelectronics (GSME) Enters Market as Globally Focused Outsourced Semiconductor Manufacturing and Operations Solutions Provider
GS Microelectronics, Inc. today announced its official launch as a global provider of Outsourced Semiconductor Manufacturing and Operations (OSeMO) services.
Showa Denko’s Program to Develop 8-inch SiC Wafers for Next-generation Green Power Semiconductor Selected for NEDO’s Green Innovation Fund Projects
Showa Denko proposed its “Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors” to New Energy and Industrial Technology Development Organization (NEDO) as a candidate for “Projects to Develop Wafers Technology for Next-generation Power Semiconductors” which was set as a research and development target of “Next-generation Digital Infrastructure Construction” in “Green Innovation Fund Projects”.
DVCon U.S. 2023 Announces Call for Extended Abstracts
The 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract proposals.

Enhancing Performance, Quality and Yield in Current and Emerging Display Technologies
Process metrology, failure analysis, and core-structure characterization can be invaluable in accelerating research and development, enhancing yield and improving display quality.
China-Based IC Production to Represent 21.2% of China IC Market in 2026
Foreign companies (e.g., Samsung, SK Hynix, TSMC, etc.) are expected continue to comprise more than 50% of IC production in China through 2026.
Synopsys and Analog Devices Collaborate to Accelerate Power System Design
Synopsys, Inc. and Analog Devices, Inc. today announced their collaboration to provide model libraries for DC/DC ICs and µModule (micromodule) regulators with Synopsys’ industry-leading simulation tool, Saber, part of Synopsys’ virtual prototyping solution.
Tiny Infrared Spectral Filters for Remote Thermal Sensing and Imaging
Readily field-deployable on-chip microspectrometer technology has applications requiring mechanical robustness, such as robotic vehicles and airborne unmanned aerial vehicles.

CMP Consumables – Supply is Tight and Costs Expected to Rise
TECHCET announced the Chemical Mechanical Planarization (CMP) consumables market for semiconductors grew almost 13% in 2021 to reach US$3.0 billion.
Texas Instruments Breaks Ground on New 300mm Semiconductor Wafer Fabrication Plant in Sherman, Texas
Texas Instruments this week broke ground on its new 300mm semiconductor wafer fabrication plants (or “fabs”) in Sherman, Texas.
Heraeus Electronics Announces Global Launch of Condura.ultra Ag Si3N4 free AMB Substrate at PCIM Europe
Heraeus Electronics this week announced the launch of its new Condura.ultra Ag free AMB Substrate.
New Breathable Gas Sensors May Improve Monitoring of Health, Environment
Newly developed flexible, porous and highly sensitive nitrogen dioxide sensors that can be applied to skin and clothing have potential applications in health care, environmental health monitoring and military use, according to researchers.
GlobalFoundries Unveils GF Labs to Accelerate Technology Innovation
At its annual GF Technology Summit (GTS), GlobalFoundries today announced the launch of GF Labs, a new program that extends the development horizon of innovative, differentiated semiconductor technology and broadens the company’s portfolio of feature-rich and enablement solutions.
GlobalFoundries Advances RF Leadership with GF Connex Portfolio and Customer Collaborations
At its annual GF Technology Summit (GTS), GlobalFoundries, today announced GF Connex, the industry’s most comprehensive and advanced portfolio of feature-rich radio frequency (RF) technology solutions for next generation wireless connectivity.

Strong Growth in Wafer Capacity for Image Sensors Expected
Global installed capacity for image sensors was one million 200mm-equivalent wafers per month at the end of 2021.
GlobalFoundries and Motorola Solutions Announce Strategic Agreement for Chip Supply
GlobalFoundries Inc. and Motorola Solutions today announced a long-term agreement to safeguard the supply of innovative chip solutions for Motorola Solutions’ radios.
Self-Driving Technology Firm Sensible 4 Receives €8 Million to Boost Sustainable Transport
The European Investment Bank (EIB) has granted an €8 million loan to Sensible 4 Oy, an innovative Finnish self-driving technology company that offers a complete and flexible autonomous driving software.
Voyager Supercomputer Enters Testbed Phase
Voyager, the experimental compute resource newly installed at the San Diego Supercomputer Center (SDSC), is ready for use.
Pall Corporation Invests in New Manufacturing Facility to Support Growing Semiconductor Demand
Pall Corporation announced the construction of a new manufacturing facility focused on solutions that will serve advanced nodes for semiconductor manufacturers.
Heraeus Electronics Introduces Optimized Copper Ribbon for Laser Bonding at PCIM Europe
Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg.
STMicroelectronics Appoints SP Group to Establish Singapore’s Largest Industrial District Cooling System for its Local Manufacturing Site
STMicroelectronics and SP Group announced today the signing of an agreement to install a district cooling system at ST AMK TechnoPark.
Jim Cannon, Head of OEM and Markets at Mettler-Toledo, talks to Pete Singer about the many aspects of water analysis in the semiconductor manufacturing industry, including the measurement of resistivity, organic materials, dissolved oxygen, sodium and silica. How the company’s analytical instrumentation and various sensors are used in common applications is reviewed, including their role in new recycling strategies.