Intel Launches AI for Workforce Program for Students in 18 Community Colleges

Intel announced a major expansion of its Intel AI for Workforce Program to help educate the next generation of U.S. technologists, engineers and inventors.

Fabrication of Printed High-Performance Thin-Film Transistors Operable at One Volt

NIMS has developed low-temperature-catalyzed, solution-processed SiO2 (LCSS), which subsequently enabled printing of high-performance thin-film transistors (TFTs) and three-dimensional circuits connecting various elements.

HEIDENHAIN’s New MULTI-DOF Encoders Do More For Metrology Designs in Machining

With the release of new MULTI Degrees-of-Freedom (MULTI-DOF) encoders, HEIDENHAIN offers machine manufacturers a better way to implement metrology designs to obtain multiple measurements simultaneously and facilitate correcting deviations on the fly.

Posifa Technologies Launches New MEMS Pirani Vacuum Transducer Evaluation Kit

Posifa Technologies today announced the availability of an evaluation kit for its PVC4000 series of digital MEMS Pirani vacuum transducer.

SMC 2021 to Highlight Semiconductor Materials Powering Future Technology Innovation

With advanced materials a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2021), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain.

Journey to SEMICON Taiwan 2021 Kicks Off in September With Five Online Forums Covering Key Semiconductor Industry Themes

The journey to SEMICON Taiwan 2021 begins in September with five live online forums featuring expert insights into critical semiconductor industry areas – Power and Opto chips, Smart Manufacturing, Sustainable Manufacturing, Smart Medtech and Cybersecurity.

FPGA Market Worth $9.1 Billion by 2026

Increase in global adoption of AI and IoT, and rising deployment of data centers and high-performance computing are among the factors driving the growth of the FPGA market.

Pfeiffer Vacuum Introduces the Reliable and Low-Vibration HiPace 80 Neo Turbopump

Pfeiffer Vacuum presents its new HiPace 80 Neo turbopump, which features a longer life before service and reduced vibration and noise emissions.

Transphorm Announces the Close of JV Transaction for Acquisition of AFSW Wafer-Fab

Transphorm, Inc. announced today the close of the transaction for the acquisition of 100% interest in the Company’s AFSW wafer-fab facility by GaNovation, Transphorm’s recent joint venture with Palo Alto-based JCP Capital, a new strategic-financial partner.

Heterogeneous Epitaxy of Semiconductors Targeting the Post-Moore Era

A research team led by Prof. LIU Zhiqiang from the Institute of Semiconductors of the Chinese Academy of Sciences, in cooperation with the team led by Prof. GAO Peng from Peking University and the team led by Prof. LIU Zhongfan from Beijing Graphene Institute (BGI), recently realized the concept of “heterogeneous epitaxy” via a van der Walls strategy, a type of nonsymmetrical epitaxy process.

New Material Offers Ecofriendly Solution to Converting Waste Heat into Energy

A team of scientists from Northwestern University and Seoul National University in Korea now has demonstrated a high-performing thermoelectric material in a practical form that can be used in device development.

In-line Airborne Particle Sensing – A Streamlined Contamination Solution for Cleanroom Environments

The IPS relieves pains of traditional monitoring methods while simultaneously increasing tool time and improving yields.

Intel Accelerates Process and Packaging Innovations

Intel Corporation this week revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond.

IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year

A 21% jump would be the largest increase in IC unit shipments since the boom year of 2010.

Merck Launches New Green Solvents for Photoresist Removal in Chip Production

Merck today announced the launch of a new line of complementary green solvents for use in photolithographic processes in semiconductor manufacturing.

CVD Completes the Sale of its 555 North Research Place Facility

CVD Equipment Corporation today announced it closed on the sale of its facility located at 555 North Research Place, Central Islip, New York for the purchase price of $24,360,000.

Covalent Metrology Expands Analytical Chemistry Capabilities with Triple-Quadrupole Inductively Coupled Plasma Mass Spectrometry

Covalent Metrology announces an expansion of its chemical analysis capabilities with the install of a Thermo Scientific iCAP TQ for inductively coupled plasma mass spectroscopy (ICP-MS)

Mobix Labs Introduces Ultra-Wideband mmWave 5G Beamformer

Mobix Labs Inc. today introduced its MBX10 True5G mmWave beamformer AIP (antenna-in-package) and its MIC600 single-chip, single-die beamformer IC (integrated circuit) that deliver ultra-wideband performance from 24.25 – 43.5 GHz.

Boston Start-up JETCOOL Technologies Inc. Offers Solution to the Global Semiconductor Chip Shortage

The semiconductor chip shortage wreaking havoc on the automotive and tech industries is forecasted to reach into 2023.

Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump

The new pumps in the HiScroll ATEX range meet the requirements of the European directive 2014/34/EU.

Micron Launches World’s First 176-Layer NAND in Mobile Solutions

Micron Technology, Inc. announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution.

ZEISS Applies Artificial Intelligence to 3D X-ray Microscope Reconstruction Technologies

Two new reconstruction technologies introduced today by ZEISS use Artificial Intelligence (AI) to improve data collection and analysis, and speed up decision-making significantly.

Kyocera Celebrates 50 Years of U.S. Manufacturing

The City of San Diego has honored Kyocera International, Inc. for 50 years of U.S. manufacturing.

Pressure-based Mass Flow Controllers for Semiconductor Processing

Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.

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EVENTS

august

202104augAll Day05FeaturedAdvancements in Thermal Management - Virtual(All Day) VIRTUAL CONFERENCE

202109augAll Day12SiP — Advanced System in Package Technology - Virtual(All Day) VIRTUAL CONFERENCE

202123augAll Day27FeaturedSEMICON Southeast Asia 2021 - Virtual(All Day) VIRTUAL CONFERENCE

september

202101sepAll Day033D & Systems Summit - Virtual(All Day) VIRTUAL CONFERENCE

202101sepAll Day03MEMS & Imaging Sensors - Virtual(All Day) VIRTUAL CONFERENCE

202120sepAll Day01octFeatured43rd Annual EOS/ESD Symposium and Exhibits(All Day) The Westin La Paloma Resort and Spa

202123sepAll Day25FeaturedSEMICON Taiwan 2021 - POSTPONED TO DEC or JAN(All Day) Taipei Nangang Exhibition Center

202127sepAll Day29FeaturedStrategic Materials Conference — SMC 2021 - Virtual(All Day) VIRTUAL CONFERENCE

202127sepAll Day30FeaturedSPIE Photomask Technology + EUV Lithography 2021(All Day) Monterey Conference Center and Monterey Marriott

october

202120sepAll Day01octFeatured43rd Annual EOS/ESD Symposium and Exhibits(All Day) The Westin La Paloma Resort and Spa

202111octAll Day13FeaturedMEMS & Sensors Executive Congress — MSEC 2021(All Day) Marriott Coronado Island Resort & Spa

202111octAll Day14Featured54th International Symposium on Microelectronics — IMAPS 2021(All Day) Town and Country Hotel & Conference Center

202131octAll Day03novFeaturedITPC 2021(All Day) Four Seasons Resort O'ahu at Ko Olina

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