MAGAZINE
June
What Do Trump’s Tariffs Mean for the European Semiconductor Industry?
For European technology businesses reliant on semiconductor supply chains, the extreme volatility of the geopolitical landscape, compounded by the ongoing Ukraine war and escalating trade tensions, makes strategic planning extremely difficult.
Asymmetric Power Biasing for Critical Plasma Semiconductor Processes
Asymmetric bias power is replacing traditional RF bias power in critical semiconductor processes due to its ability to provide tailored ion energy distributions (IEDs) to the wafer surface. A particle-in-cell model compares IEDs from different bias waveforms.
Accelerate Failure Analysis of Heterogeneously Integrated Packages with AI-Powered Correlative Microscopy
A three-step physical failure analysis process dedicated to analyzing fine structures and defects in hybrid bonding and FOWLP packages demonstrates high accuracy and precision, while AI-powered reconstruction accelerates the speed of 3D X-ray scans.
Breakthrough in Atomically Thin Semiconductors: Large-Scale Controlled Doping and Integration Achieved
The continued scaling of silicon transistors faces major challenges due to leakage current increase and on/off ratio degradation from short-channel and medium tunneling effect.
IEEE Study Achieves Efficient Integration of Quantum Dot Lasers on Silicon Chiplets
III-V semiconductor lasers can be monolithically integrated with photonic chips by directly growing a crystalline layer of laser material, such as indium arsenide, on silicon substrate.
DNP to Open First Overseas R&D Center in the Netherlands
Dai Nippon Printing Co., Ltd. will open its first overseas Research and Development (R&D) Center in the Netherlands in September 2025.
Semiconductor Effort Advances in NSF Regional Innovation Engines Program
Proposal aims to harness AI to improve chip design, recruit and train a highly skilled workforce and foster regional economic growth.
IC’Alps Joins GlobalFoundries GlobalSolutions Ecosystem to Accelerate ASIC Development
IC’Alps, a French company specializing in the design and supply of full-custom ASICs (Application-Specific Integrated Circuit) and custom IP design, announced that it has joined GlobalFoundries’ (GF) GlobalSolutions ecosystem.
STMicroelectronics and Metalenz Sign a New License Agreement
STMicroelectronics and Metalenz announced a new license agreement.
Smartkem Announces Preliminary Joint Development Agreement with Manz Asia
Smartkem today announced that it has entered into a preliminary Joint Development Agreement (JDA) with Manz Asia, a pioneer in advanced packaging equipment for the semiconductor industry.
Buck Institute Awarded DARPA Contract to Pioneer Next-Gen AI Modeling Platform
The Buck Institute for Research on Aging has secured a significant contract from the Defense Advanced Research Projects Agency (DARPA) to spearhead the Simulation and Inference of Microbial Behavior and Adaptation (SIMBA) project.
TECHCET Projects Sputtering Target Revenues Rising Nearly 9% in 2025
Growth driven by demand recovery and metal price appreciation, despite trade pressures.
Nvidia’s Historic $4 Trillion Market Cap Highlights AI Chip Sector’s Central Role in Tech Supremacy
Nvidia briefly became the first publicly traded company in history to reach a market capitalization of $4 trillion yesterday, outpacing tech giants Apple and Microsoft, and marking a pivotal moment in the global AI landscape.
Archer Demonstrates Cryogenic TMR Sensor Functionality for Potential Use Across Quantum Computing Platforms
Archer Materials Limited announces the successful demonstration of highly sensitive magnetic field measurements at cryogenic temperatures using TMR sensors.
Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S
Nordson Test & Inspection today announced that smartTec will expand distribution of X-Ray and Test Solutions to include Denmark, Norway, Finland, Sweden, Latvia, Lithuania and Estonia.
Polymatech Electronics Appoints Allen Nejah as Chief Innovation Officer and Head of New Product Development
Polymatech Electronics, India’s pioneering semiconductor company headquartered in Chennai, announced the appointment of Allen Nejah as Chief Innovation Officer and Head of New Product Development.
Materion Completes Acquisition to Expand Semiconductor Footprint and Capabilities in Asia
Materion reported today that it has completed its previously announced acquisition of manufacturing assets for tantalum solutions in Dangjin City, South Korea, serving the semiconductor market.
First Look at Defects in Single-Crystal Indium Gallium Zinc Oxide Could Fix Persistent Display Instability
Insights into atomic-scale defects may enable next-generation thin-film transistors for smartphones, televisions, and flexible electronics.
Semiconductors Show Promise for Efficient Carbon Capture and Utilization
Innovative catalyst design enables the selective conversion of carbon dioxide into methanol.
JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance
JEDEC Solid State Technology Association today announced the publication of JESD209-6, the latest Low Power Double Data Rate 6 (LPDDR6) standard.
New Microtronic WaferWeight Monitors Semiconductor Wafer Mass During Macro Defect Inspection
Microtronic, maker of advanced macro defect inspection systems and software, has announced a convenient and highly precise way to monitor the weights of semiconductor wafers at the same time as defects are being inspected – all on a single tool.
Opening Doors to Smaller, Smarter Devices
Researchers at the University of California, Riverside, have uncovered how to manipulate electrical flow through crystalline silicon, a material at the heart of modern technology.
SK hynix Adopts Infinitesima 3D Metrology Tool for Volume DRAM Production
Infinitesima today announced that SK hynix, a full stack artificial intelligence (AI) memory provider, has adopted the Metron3D 300mm in-line wafer metrology system and released it for use in volume production.
Featured Video
At SEMICON West 2024, Advanced Energy further expanded on the theme of ‘Advancing the Angstrom Era’ by demonstrating its latest plasma power, high-voltage and critical temperature measurement and control technologies. Editor-in-Chief Pete Singer talked to Dhaval Dhayatkar, a Senior Director of Marketing of Plasma Power at Advanced Energy, about the company’s latest products, including new, modular platforms that meet demands for high power, high efficiency and power density AC-DC solutions across semiconductor processing and test equipment.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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