MAGAZINE
June
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
Diamond Technologies Inc. Acquires Full Asset Portfolio of Akhan Semiconductor
The transaction includes all patents, trade secrets, intellectual property, proprietary machinery, and engineered materials developed by Akhan over the past decade.
Intel Appoints Sales and Engineering Leaders
Intel today announced a series of leadership appointments aligned with its focus on strengthening customer relationships and becoming a more engineering-focused company.
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
Infineon Reports Milestone: 10 Billion Chips with Integrity Guard Delivered
Since its introduction, well over 10 billion security controllers based on Integrity Guard security architecture by Infineon Technologies AG have been delivered – marking a major milestone in the architecture’s global adoption.
KAIST Researchers Unveil An AI That Generates “Unexpectedly Original” Designs
KAIST researchers have developed a technology that can enhance the creativity of text-based image generation models such as Stable Diffusion without additional training, allowing AI to draw creative chair designs that are far from ordinary.
EU Project ELENA Pioneers LNOI Platform for Next-Gen Photonic Circuits & Europe’s 1st Commercial Supplier of LNOI Wafers
A recently concluded 42-month EU project, ELENA, announced today the development of the first-ever, European-made lithium niobate on insulator (LNOI) substrates for photonic integrated circuits (PICs)—a breakthrough that establishes a fully European supply chain for thin-film lithium niobate (TFLN) technology.
Novel Technologies to Advance Next-Generation Semiconductor Packaging
Precise and high-speed bonding onto a 300mm waffle wafer for a new power distribution channel that enables high-quality power delivery.
TECHCET Predicts Semiconductor ALD/CVD Precursor Market Outlook, Highlights Growth
Despite heavy reliance on imports of critical materials like cobalt, tungsten, and rare earths.
Nuvvon Reports a Major Breakthrough in Solid-State Battery Scalability
Nuvvon, a leader in next-generation energy storage, reported a major breakthrough in solid-state battery scalability.
Wafer-Scale Accelerators Could Redefine AI
The promise of a new type of computer chip that could reshape the future of artificial intelligence and be more environmentally friendly is explored in a technology review paper published by UC Riverside engineers in the journal Device.
yieldWerx and PTC Announce Strategic Collaboration
yieldWerx and PTC have announced a strategic collaboration to address the growing need for comprehensive data analytics across the semiconductor manufacturing lifecycle in the rapidly expanding markets of Malaysia and India.
UMass Researchers Advance In-Sensor Visual Processing Technology
The experimental analog hardware could perform better than state-of-the-art computer vision methods.
ULVAC Continues Participation in “Lab-in-Fab” Project to Advance Piezoelectric MEMS Technology
ULVAC will continue its participation in this initiative, contributing to the commercialization of piezoMEMS by providing deposition and etching technologies as an equipment manufacturer.
TECHCET Projects 6.4% CAGR for Silicon Wafers Through 2029
TECHCET forecasts a 3.8% increase in silicon wafer revenues in 2025, reaching approximately US $14.0 billion.
Better Images for Humans and Computers
Researchers at ETH Zurich and Empa have developed a new image sensor made of perovskite. This semiconductor material enables better color reproduction and fewer image artefacts with less light. Perovskite sensors are also particularly well suited for machine vision.
Nordic Semiconductor Acquires Neuton.AI
Nordic Semiconductor today announced its acquisition of the intellectual property and core technology assets of Neuton.AI, a pioneer in fully automated TinyML solutions for edge devices.
Texas Instruments Plans to Invest More Than $60B to Manufacture Billions of Semiconductors in the U.S.
Texas Instruments today announced its plans to invest more than $60 billion across seven U.S. semiconductor fabs, making this the largest investment in foundational semiconductor manufacturing in U.S. history.
Empower and Marvell Announce Collaboration on Next-Generation Integrated Power Delivery Solution for AI and Cloud Platforms
Empower Semiconductor announced today a collaboration with Marvell Technology, Inc. to develop optimized integrated power solutions for Marvell custom silicon platforms.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.
CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits
CEA-Leti and Soitec today announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator (FD-SOI) technologies.
Photonic to Open Quantum R&D Facility in the UK
Company to invest over £25 million in UK quantum facility, creating high-paying technical jobs.
Arteris Accelerates AI-Driven Silicon Innovation with Expanded Multi-Die Solution
In a market reshaped by the compute demands of AI, Arteris, Inc., a provider of system IP for accelerating semiconductor creation, today announced an expansion of its multi-die solution, delivering a foundational technology for rapid chiplet-based innovation.
Jabil Announces Planned Multi-Year $500 Million Investment in U.S. Manufacturing for Cloud and AI Data Center Infrastructure
Jabil Inc. today announced it intends to invest approximately $500 million over the next several years to expand its footprint in the Southeast United States to support cloud and AI data center infrastructure customers.
Research Study Demonstrates Novel Synthesis of High-Quality 2D Molybdenum Disulfide Using Veeco’s Fiji ALD System
Veeco Instruments Inc. announced today that the University of Michigan has published a breakthrough study on atomic layer deposition (ALD) of molybdenum disulfide (MoS2) using di-tert-butyl disulfide (TBDS) as a replacement for hydrogen sulfide (H2S).
Featured Video
At SEMICON West 2024, Editor-in-Chief Pete Singer caught up with Nordson TEST & INSPECTION’s Carla Furanna who provides some insights into the company’s products for front, middle and backend applications. Products highlighted at the show include WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), and Gen 7™ Acoustic Micro Imaging (AMI) system. Additionally, the innovative SpinSAM™ AMI system was unveiled for the first time at the show. The new system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
