Purdue Launches Nation’s First Comprehensive Semiconductor Degrees Program

In the next five years, a minimum of 50,000 trained semiconductor engineers will be needed in the United States to meet the overwhelming and rapidly growing demand.

Intel Selects Diverse Ohio-Based Team to Lead Early Excavation Work for Ohio Fabs

McDaniel’s Construction Corp., Northstar Contracting Inc. and GTSA Construction Consulting, in partnership with Gilbane Building Company, represent first of projected 7,000 construction jobs.

Synopsys Appoints Two New Directors

Synopsys, Inc. today announced the appointment of Luis Borgen and Marc Casper to its board of directors.

SEMI Foundation Awarded $1.5 Million Grant to Bolster Michigan’s Semiconductor Industry Talent Pipeline

SEMI and Michigan Governor Gretchen Whitmer today announced with the Michigan Economic Development Corporation that the SEMI Foundation has been awarded $1.5 million in funding to design and develop the SEMI Career and Apprenticeship Network (SCAN) in Michigan.

SCREEN Increases Efforts to Reduce the Environmental Impact of the Semiconductor Industry

SCREEN Semiconductor Solutions Co., Ltd., a subsidiary of SCREEN Holdings Co., Ltd., has announced it will increase its efforts to reduce the company’s environmental overall impact.

Keysight Technologies Recognized for Supplier Excellence by Texas Instruments

Keysight Technologies, Inc., a technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced the company has received a 2021 Supplier Excellence Award from Texas Instruments (TI), as part of its annual supplier awards program and their highest level of supplier recognition.

New eBook from ROHM Semiconductor and Mouser Explores Efficient Power Conversion in IIoT

Mouser Electronics, Inc. in collaboration with ROHM Semiconductor announces a new eBook that focuses on efficient components and technologies for use in low-power solutions for industrial Internet of Things (IoT) applications.

IEEE International Electron Devices Meeting (IEDM) Announces 2022 Call for Papers

Under the theme, “The 75th anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges,” the 68th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

Applied Materials’ New Ioniq PVD System Solves Wiring Resistance Challenges of 2D Scaling

Applied Materials, Inc. today introduced a new system that re-engineers the deposition of transistor wiring to significantly reduce electrical resistance, which has become a critical bottleneck to further improvements in chip performance and power.

Showa Denko Starts Shipment of Newly Developed HD Media for Record-breaking 26TB Near-line HDD

Showa Denko K.K. (SDK) has started shipment of newly developed 3.5-inch hard disk media (HD media) to be used in 26 terabyte (TB) hard disk drive (HDD), which has the largest storage capacity the HDD industry has ever produced.

MegaChips Forms Strategic Partnership with BrainChip

MegaChips, a custom ASIC company in Japan, and BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power neuromorphic AI IP, formally announced a strategic partnership signed late last year.

Beyond Semiconductor Packaging Materials: Advanced Silicone Solutions

Advanced silicones are enabling semiconductor manufacturers to address a variety of challenges.

Gov. Whitmer Announces New Semiconductor Career and Apprenticeship Network Program Aimed at Creating Good-Paying Jobs

Today, Governor Gretchen Whitmer joined the Michigan Economic Development Corporation to announce Michigan Strategic Fund (MSF) approval of support for a new semiconductor technician apprenticeship program intended to strengthen the pipeline of the semiconductor workforce.

Ayar Labs to Accelerate Development and Application of Optical Interconnects in Artificial Intelligence/Machine Learning Architectures with NVIDIA

Ayar Labs is developing with NVIDIA groundbreaking artificial intelligence (AI) infrastructure based on optical I/O technology to meet future demands of AI and high performance computing (HPC) workloads.

EV Group Lithography Solutions for Heterogenous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2022

EV Group (EVG) announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced lithography solutions will be highlighted in several papers being presented at the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), to be held May 31-June 3 in San Diego, Calif.

Samsung Electronics and Red Hat Announce Collaboration in the Field of Next-Generation Memory Software

Samsung Electronics Co., Ltd. and Red Hat, Inc. today announced a broad collaboration on software technologies for next-generation memory solutions.

Argonne Scientists Use Quantum Computers to Simulate Quantum Materials

Scientists achieve important milestone in making quantum computing more effective.

Diamondx Selected for Internet of Things Semiconductor Test

Cohu, Inc. today announced a U.S. semiconductor manufacturer has selected the Diamondxplatform for testing their product portfolio.

GS Microelectronics (GSME) Enters Market as Globally Focused Outsourced Semiconductor Manufacturing and Operations Solutions Provider

GS Microelectronics, Inc. today announced its official launch as a global provider of Outsourced Semiconductor Manufacturing and Operations (OSeMO) services.

Showa Denko’s Program to Develop 8-inch SiC Wafers for Next-generation Green Power Semiconductor Selected for NEDO’s Green Innovation Fund Projects

Showa Denko proposed its “Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors”  to New Energy and Industrial Technology Development Organization (NEDO) as a candidate for “Projects to Develop Wafers Technology for Next-generation Power Semiconductors” which was set as a research and development target of “Next-generation Digital Infrastructure Construction” in “Green Innovation Fund Projects”.

DVCon U.S. 2023 Announces Call for Extended Abstracts

The 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract proposals.

Enhancing Performance, Quality and Yield in Current and Emerging Display Technologies

Process metrology, failure analysis, and core-structure characterization can be invaluable in accelerating research and development, enhancing yield and improving display quality.

China-Based IC Production to Represent 21.2% of China IC Market in 2026

Foreign companies (e.g., Samsung, SK Hynix, TSMC, etc.) are expected continue to comprise more than 50% of IC production in China through 2026.

Mettler-Toledo — The importance of ultrapure water (UPW) monitoring and control

Jim Cannon, Head of OEM and Markets at Mettler-Toledo, talks to Pete Singer about the many aspects of water analysis in the semiconductor manufacturing industry, including the measurement of resistivity, organic materials, dissolved oxygen, sodium and silica. How the company’s analytical instrumentation and various sensors are used in common applications is reviewed, including their role in new recycling strategies.

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