MAGAZINE
June/July 2021
Intel Launches AI for Workforce Program for Students in 18 Community Colleges
Intel announced a major expansion of its Intel AI for Workforce Program to help educate the next generation of U.S. technologists, engineers and inventors.
Fabrication of Printed High-Performance Thin-Film Transistors Operable at One Volt
NIMS has developed low-temperature-catalyzed, solution-processed SiO2 (LCSS), which subsequently enabled printing of high-performance thin-film transistors (TFTs) and three-dimensional circuits connecting various elements.
HEIDENHAIN’s New MULTI-DOF Encoders Do More For Metrology Designs in Machining
With the release of new MULTI Degrees-of-Freedom (MULTI-DOF) encoders, HEIDENHAIN offers machine manufacturers a better way to implement metrology designs to obtain multiple measurements simultaneously and facilitate correcting deviations on the fly.
Posifa Technologies Launches New MEMS Pirani Vacuum Transducer Evaluation Kit
Posifa Technologies today announced the availability of an evaluation kit for its PVC4000 series of digital MEMS Pirani vacuum transducer.
SMC 2021 to Highlight Semiconductor Materials Powering Future Technology Innovation
With advanced materials a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2021), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain.
Journey to SEMICON Taiwan 2021 Kicks Off in September With Five Online Forums Covering Key Semiconductor Industry Themes
The journey to SEMICON Taiwan 2021 begins in September with five live online forums featuring expert insights into critical semiconductor industry areas – Power and Opto chips, Smart Manufacturing, Sustainable Manufacturing, Smart Medtech and Cybersecurity.
FPGA Market Worth $9.1 Billion by 2026
Increase in global adoption of AI and IoT, and rising deployment of data centers and high-performance computing are among the factors driving the growth of the FPGA market.
Pfeiffer Vacuum Introduces the Reliable and Low-Vibration HiPace 80 Neo Turbopump
Pfeiffer Vacuum presents its new HiPace 80 Neo turbopump, which features a longer life before service and reduced vibration and noise emissions.
Transphorm Announces the Close of JV Transaction for Acquisition of AFSW Wafer-Fab
Transphorm, Inc. announced today the close of the transaction for the acquisition of 100% interest in the Company’s AFSW wafer-fab facility by GaNovation, Transphorm’s recent joint venture with Palo Alto-based JCP Capital, a new strategic-financial partner.
Heterogeneous Epitaxy of Semiconductors Targeting the Post-Moore Era
A research team led by Prof. LIU Zhiqiang from the Institute of Semiconductors of the Chinese Academy of Sciences, in cooperation with the team led by Prof. GAO Peng from Peking University and the team led by Prof. LIU Zhongfan from Beijing Graphene Institute (BGI), recently realized the concept of “heterogeneous epitaxy” via a van der Walls strategy, a type of nonsymmetrical epitaxy process.
New Material Offers Ecofriendly Solution to Converting Waste Heat into Energy
A team of scientists from Northwestern University and Seoul National University in Korea now has demonstrated a high-performing thermoelectric material in a practical form that can be used in device development.
In-line Airborne Particle Sensing – A Streamlined Contamination Solution for Cleanroom Environments
The IPS relieves pains of traditional monitoring methods while simultaneously increasing tool time and improving yields.
Intel Accelerates Process and Packaging Innovations
Intel Corporation this week revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond.
IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
A 21% jump would be the largest increase in IC unit shipments since the boom year of 2010.
Merck Launches New Green Solvents for Photoresist Removal in Chip Production
Merck today announced the launch of a new line of complementary green solvents for use in photolithographic processes in semiconductor manufacturing.
CVD Completes the Sale of its 555 North Research Place Facility
CVD Equipment Corporation today announced it closed on the sale of its facility located at 555 North Research Place, Central Islip, New York for the purchase price of $24,360,000.
Covalent Metrology Expands Analytical Chemistry Capabilities with Triple-Quadrupole Inductively Coupled Plasma Mass Spectrometry
Covalent Metrology announces an expansion of its chemical analysis capabilities with the install of a Thermo Scientific iCAP TQ for inductively coupled plasma mass spectroscopy (ICP-MS)
Mobix Labs Introduces Ultra-Wideband mmWave 5G Beamformer
Mobix Labs Inc. today introduced its MBX10 True5G mmWave beamformer AIP (antenna-in-package) and its MIC600 single-chip, single-die beamformer IC (integrated circuit) that deliver ultra-wideband performance from 24.25 – 43.5 GHz.
Boston Start-up JETCOOL Technologies Inc. Offers Solution to the Global Semiconductor Chip Shortage
The semiconductor chip shortage wreaking havoc on the automotive and tech industries is forecasted to reach into 2023.
Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump
The new pumps in the HiScroll ATEX range meet the requirements of the European directive 2014/34/EU.
Micron Launches World’s First 176-Layer NAND in Mobile Solutions
Micron Technology, Inc. announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution.
ZEISS Applies Artificial Intelligence to 3D X-ray Microscope Reconstruction Technologies
Two new reconstruction technologies introduced today by ZEISS use Artificial Intelligence (AI) to improve data collection and analysis, and speed up decision-making significantly.
Kyocera Celebrates 50 Years of U.S. Manufacturing
The City of San Diego has honored Kyocera International, Inc. for 50 years of U.S. manufacturing.
Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.
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The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
Driving Fab Performance Metrics from the Sub-Fab to the Cleanroom
By Alan Ifould This is the 10th post to this blog in a year where change has been an overriding theme.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
A Claim That TSMC Has a 1nm Process Hits the Headlines
Less than two weeks after IBM announced their 2-nanometer CMOS technology, UK website Verdict picked up on a paper published in Nature and somehow morphed that into a claim that TSMC had made breakthrough in 1-nm technology development.
