In the next five years, a minimum of 50,000 trained semiconductor engineers will be needed in the United States to meet the overwhelming and rapidly growing demand.
McDaniel’s Construction Corp., Northstar Contracting Inc. and GTSA Construction Consulting, in partnership with Gilbane Building Company, represent first of projected 7,000 construction jobs.
Synopsys, Inc. today announced the appointment of Luis Borgen and Marc Casper to its board of directors.
SEMI and Michigan Governor Gretchen Whitmer today announced with the Michigan Economic Development Corporation that the SEMI Foundation has been awarded $1.5 million in funding to design and develop the SEMI Career and Apprenticeship Network (SCAN) in Michigan.
SCREEN Semiconductor Solutions Co., Ltd., a subsidiary of SCREEN Holdings Co., Ltd., has announced it will increase its efforts to reduce the company’s environmental overall impact.
Keysight Technologies, Inc., a technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced the company has received a 2021 Supplier Excellence Award from Texas Instruments (TI), as part of its annual supplier awards program and their highest level of supplier recognition.
Mouser Electronics, Inc. in collaboration with ROHM Semiconductor announces a new eBook that focuses on efficient components and technologies for use in low-power solutions for industrial Internet of Things (IoT) applications.
Under the theme, “The 75th anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges,” the 68th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Applied Materials, Inc. today introduced a new system that re-engineers the deposition of transistor wiring to significantly reduce electrical resistance, which has become a critical bottleneck to further improvements in chip performance and power.
Showa Denko K.K. (SDK) has started shipment of newly developed 3.5-inch hard disk media (HD media) to be used in 26 terabyte (TB) hard disk drive (HDD), which has the largest storage capacity the HDD industry has ever produced.
MegaChips, a custom ASIC company in Japan, and BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power neuromorphic AI IP, formally announced a strategic partnership signed late last year.
Advanced silicones are enabling semiconductor manufacturers to address a variety of challenges.
Today, Governor Gretchen Whitmer joined the Michigan Economic Development Corporation to announce Michigan Strategic Fund (MSF) approval of support for a new semiconductor technician apprenticeship program intended to strengthen the pipeline of the semiconductor workforce.
Ayar Labs is developing with NVIDIA groundbreaking artificial intelligence (AI) infrastructure based on optical I/O technology to meet future demands of AI and high performance computing (HPC) workloads.
EV Group (EVG) announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced lithography solutions will be highlighted in several papers being presented at the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), to be held May 31-June 3 in San Diego, Calif.
Samsung Electronics Co., Ltd. and Red Hat, Inc. today announced a broad collaboration on software technologies for next-generation memory solutions.
Scientists achieve important milestone in making quantum computing more effective.
Cohu, Inc. today announced a U.S. semiconductor manufacturer has selected the Diamondxplatform for testing their product portfolio.
GS Microelectronics, Inc. today announced its official launch as a global provider of Outsourced Semiconductor Manufacturing and Operations (OSeMO) services.
Showa Denko proposed its “Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors” to New Energy and Industrial Technology Development Organization (NEDO) as a candidate for “Projects to Develop Wafers Technology for Next-generation Power Semiconductors” which was set as a research and development target of “Next-generation Digital Infrastructure Construction” in “Green Innovation Fund Projects”.
The 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract proposals.
Process metrology, failure analysis, and core-structure characterization can be invaluable in accelerating research and development, enhancing yield and improving display quality.
Foreign companies (e.g., Samsung, SK Hynix, TSMC, etc.) are expected continue to comprise more than 50% of IC production in China through 2026.
Mettler-Toledo — The importance of ultrapure water (UPW) monitoring and control
Jim Cannon, Head of OEM and Markets at Mettler-Toledo, talks to Pete Singer about the many aspects of water analysis in the semiconductor manufacturing industry, including the measurement of resistivity, organic materials, dissolved oxygen, sodium and silica. How the company’s analytical instrumentation and various sensors are used in common applications is reviewed, including their role in new recycling strategies.
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