MAGAZINE
August/September
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the August/September issue…
GlobalFoundries and Qualcomm Sign Agreement to Deliver Advanced 5G RF Front-End Products
GlobalFoundries (GF) and Qualcomm Global Trading PTE. Ltd., a subsidiary of Qualcomm Technologies, Inc., announced that they are extending their successful RF collaboration on 5G multi-Gigabit speed RF front-end products for delivering the high cellular speeds, superior coverage, and outstanding power efficiency in the sleek form factors users expect from the newest generation of 5G-enabled products.
MSEC 2021 to Highlight Leading-Edge MEMS and Sensors Innovations as IoT Spending Surges
Returning to a live format, MEMS and Sensors Executive Conference (MSEC 2021) will gather industry visionaries and experts October 11-13 at the Coronado Island Marriott Resort in San Diego for insights into the latest trends and innovations in sensorization for growth markets including medical, fitness, connected communities, environmental and air quality, and wearables.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the August/September issue…
ITRI, AITA, and UCLA CHIPS Forge Cooperation on AI Chip Development
The Department of Industrial Technology (DoIT) of the Ministry of Economic Affairs (MOEA) is supporting the commencement of cooperation between Industrial Technology Research Institute (ITRI), the AI on Chip Taiwan Alliance (AITA), and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS).
JSR Agrees to Acquire EUV Pioneer Inpria Corporation
JSR announced today that it has signed an agreement for the acquisition of Corvallis, OR based Inpria Corporation, an innovator of metal oxide photoresist design, development and manufacturing for extreme ultraviolet (EUV) lithography, for USD $514 million.
Samsung Steps Up Hiring, Focuses on DTC and Semiconductor Technology, Finds GlobalData
Samsung stepped up hiring in 2021 amid a push to increase direct-to-consumer (DTC) operations.
GlobalFoundries Unveils Innovative Solutions that Deliver a New Era of More in Semiconductor Manufacturing
GlobalFoundries (GF) today announced a portfolio of new features that extend its solutions roadmap and accelerate the next wave of innovation in chip design for smart mobile devices,datacenter, IoT and automotive.
TrendForce Announces 10 Tech Industry Trends for 2022
In a recent statement, TrendForce detailed 10 major trends that are expected to take place across various segments in the tech industry.
A Simple Way to Get Complex Semiconductors to Assemble Themselves
Much like crystallizing rock candy from sugar syrup, the new method grows 2D perovskites precisely layered with other 2D materials to produce crystals with a wide range of electronic properties.
Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round
AI semiconductor startup Axelera AI announced today that it has successfully closed a seed investment round of $12 million.
Elissa Murphy Joins GlobalFoundries Board
GlobalFoundries (GF) today announced Elissa Murphy is joining the company’s board of directors with immediate effect as an independent director.
pSemi Expands APAC Footprint with New Taiwan Branch Office
pSemi Corporation, a Murata company focused on semiconductor integration, announces the opening of a branch office in Taipei City, Taiwan.
AKHAN Semiconductor Appoints Tom Lacey Interim CEO
AKHAN Semiconductor announced today that prolific technology executive Tom Lacey has added Interim CEO to his role as the Company’s Board Chairman.
Towards More Energy-Efficient 2D Semiconductor Devices
SUTD researchers show how a newly discovered family of two-dimensional (2D) semiconductors are more energy-efficient thanks to the presence of a built-in atomic protection layer.
AI Processor Chipmaker Deep Vision Raises $35 Million in Series B Funding
Deep Vision, Inc., the developers of an AI processor and comprehensive software development suite for edge computing applications, today announced that it received $35 million in a Series B financing round, led by Tiger Global.
Palomar Technologies new 3880-II Die Bonder Maximizes Productivity from R&D to Volume, Automated Bonding
Palomar Technologies today announced the availability of their new Palomar 3880-II Die Bonder.
Pfeiffer Vacuum Presents a Cloud-Based Solution for Service Management
Pfeiffer Vacuum’s new “Virtual Service Management” (VSM) is a free web app that makes it possible to manage vacuum equipment from different manufacturers.
Edwards Opens Lab at Hillsboro Innovation Center to Nurture Collaborative Solutions for Critical Industry Challenges
Edwards, a supplier of vacuum and abatement equipment to the semiconductor manufacturing industry, has opened a chemical laboratory at its Innovation Center in Hillsboro, OR.
Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly US$100 billion to meet soaring demand for electronics after topping a projected $90 billion this year, both new records, SEMI highlighted today in its World Fab Forecast report.
Synopsys PrimeSim Reliability Analysis Solution Accelerates Design of Hyper-Convergent ICs for Mission-Critical Applications
Synopsys, Inc. today shared that several leading semiconductor companies have adopted its new PrimeSim Reliability Analysis solution that unifies production-proven, foundry-certified reliability analysis technologies for analog, mixed-signal and full-custom designs.
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing.
Sputter Targets & Metals Demand Met with COVID-impacted Lead-times and Costs
Delivery lead-times lengthening and costs spike as Targets Revenues push ahead 8.5% to US$740 Million.
GaN Systems Signs Semiconductor Capacity Agreement with BMW
GaN Systems today announced the signing of a comprehensive Capacity Agreement with BMW Group for GaN Systems’ high-performance, automotive-grade GaN power transistors, which increase the efficiency and power density of critical applications in electric vehicles.
Gartner Identifies Four Trends Driving Near-Term Artificial Intelligence Innovation
Four trends on the Gartner, Inc. Hype Cycle for Artificial Intelligence, 2021 are driving near-term artificial intelligence (AI) innovation.
Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.
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The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
Driving Fab Performance Metrics from the Sub-Fab to the Cleanroom
By Alan Ifould This is the 10th post to this blog in a year where change has been an overriding theme.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
AMD Announces Use of TSMC 3D Fabric for Stacked Vertical SRAM Cache, TechInsights Confirms Current Ryzen 5950X is TSV-Capable
At Computex a couple of months ago Lisa Su of AMD gave a keynote talk detailing their new products, but at the tail end she surprised attendees by discussing their advancements in packaging technology.
