Intel announced a major expansion of its Intel AI for Workforce Program to help educate the next generation of U.S. technologists, engineers and inventors.
NIMS has developed low-temperature-catalyzed, solution-processed SiO2 (LCSS), which subsequently enabled printing of high-performance thin-film transistors (TFTs) and three-dimensional circuits connecting various elements.
With the release of new MULTI Degrees-of-Freedom (MULTI-DOF) encoders, HEIDENHAIN offers machine manufacturers a better way to implement metrology designs to obtain multiple measurements simultaneously and facilitate correcting deviations on the fly.
Posifa Technologies today announced the availability of an evaluation kit for its PVC4000 series of digital MEMS Pirani vacuum transducer.
With advanced materials a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2021), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain.
The journey to SEMICON Taiwan 2021 begins in September with five live online forums featuring expert insights into critical semiconductor industry areas – Power and Opto chips, Smart Manufacturing, Sustainable Manufacturing, Smart Medtech and Cybersecurity.
Increase in global adoption of AI and IoT, and rising deployment of data centers and high-performance computing are among the factors driving the growth of the FPGA market.
Pfeiffer Vacuum presents its new HiPace 80 Neo turbopump, which features a longer life before service and reduced vibration and noise emissions.
Transphorm, Inc. announced today the close of the transaction for the acquisition of 100% interest in the Company’s AFSW wafer-fab facility by GaNovation, Transphorm’s recent joint venture with Palo Alto-based JCP Capital, a new strategic-financial partner.
A research team led by Prof. LIU Zhiqiang from the Institute of Semiconductors of the Chinese Academy of Sciences, in cooperation with the team led by Prof. GAO Peng from Peking University and the team led by Prof. LIU Zhongfan from Beijing Graphene Institute (BGI), recently realized the concept of “heterogeneous epitaxy” via a van der Walls strategy, a type of nonsymmetrical epitaxy process.
A team of scientists from Northwestern University and Seoul National University in Korea now has demonstrated a high-performing thermoelectric material in a practical form that can be used in device development.
The IPS relieves pains of traditional monitoring methods while simultaneously increasing tool time and improving yields.
Intel Corporation this week revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond.
A 21% jump would be the largest increase in IC unit shipments since the boom year of 2010.
Merck today announced the launch of a new line of complementary green solvents for use in photolithographic processes in semiconductor manufacturing.
CVD Equipment Corporation today announced it closed on the sale of its facility located at 555 North Research Place, Central Islip, New York for the purchase price of $24,360,000.
Covalent Metrology announces an expansion of its chemical analysis capabilities with the install of a Thermo Scientific iCAP TQ for inductively coupled plasma mass spectroscopy (ICP-MS)
Mobix Labs Inc. today introduced its MBX10 True5G mmWave beamformer AIP (antenna-in-package) and its MIC600 single-chip, single-die beamformer IC (integrated circuit) that deliver ultra-wideband performance from 24.25 – 43.5 GHz.
The semiconductor chip shortage wreaking havoc on the automotive and tech industries is forecasted to reach into 2023.
The new pumps in the HiScroll ATEX range meet the requirements of the European directive 2014/34/EU.
Micron Technology, Inc. announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution.
Two new reconstruction technologies introduced today by ZEISS use Artificial Intelligence (AI) to improve data collection and analysis, and speed up decision-making significantly.
The City of San Diego has honored Kyocera International, Inc. for 50 years of U.S. manufacturing.
Pressure-based Mass Flow Controllers for Semiconductor Processing
Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.
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