MAGAZINE
January/February
What’s in the January/February Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the January/February issue.
Intel and UC San Diego Join DARPA Program to Prevent Exploitation of Computing Systems
Intel and the University of California, San Diego have been selected for the DARPA Hardening Development Toolchains Against Emergent Execution Engines program.
Axcelis President and CEO Mary Puma Named International Board Chairperson of SEMI Industry Association
Puma will lead the SEMI International Board of Directors in evolving the association’s operations, programs and services worldwide to support the growth of member companies throughout the supply chain.
What’s in the January/February Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the January/February issue.
Littelfuse Acquires Western Automation Research and Development
Littelfuse, Inc. today announced it has acquired Western Automation Research and Development Limited.
Alchip Technologies Announces 3DFabric Alliance Support Plans
Alchip Technologies is putting teeth into its role as a founding member of TSMC’s 3DFabric Alliance by enhancing its 3nm process technology and advanced packaging capabilities.
CAES Wins Award to Deliver Dual System-in-Package Circuit Card Assemblies
Award marks continued partnership with CAES, MITRE and the US Air Force to deliver advanced electronics.
Integra Selects Kansas for OSAT Semiconductor Project
Kansas State Finance Council’s APEX vote paves way for
transformative expansion project in Wichita region
U.S. and India Semiconductor Groups Announce Initiative to Strengthen Public-Private Collaboration in Chip Ecosystem
The U.S. Semiconductor Industry Association (SIA) and the India Electronics and Semiconductor Association (IESA) today jointly announced plans to form a private-sector task force that will strengthen collaboration between the two countries in the global semiconductor ecosystem.
pSemi Announces High-linearity Sub-6 GHz RF Switches Reach Volume Production
pSemi Corporation, a Murata company focused on semiconductor integration, announces the production readiness of two new high-linearity switches targeted for the latest 5G wireless infrastructure and massive MIMO base station deployments.
MACOM Announces Definitive Agreement to Acquire Assets and Operations of OMMIC SAS
MACOM Technology Solutions Holdings, Inc., a supplier of semiconductor products, today announced that it has entered into a definitive agreement through one of its French subsidiaries to acquire the assets and operations of OMMIC SAS.
Azbil Launches New Sapphire Capacitance Diaphragm Gauges with MEMS Processing Technology to Enhance Resistance to Deposition
Azbil Corporation announced the availability as of January 25 of its model V8 sapphire capacitance diaphragm gauges, which employ MEMS processing technology to enhance resistance to deposition on the sensor.
Engineers Invent Vertical, Full-Color Microscopic LEDs
Stacking light-emitting diodes instead of placing them side by side could enable fully immersive virtual reality displays and higher-resolution digital screens.
POET Technologies Partners with LuxshareTech and Announces Availability of 400G and 800G Receive Optical Engines
POET Technologies Inc.,the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center, telecommunication and artificial intelligence markets, today announced that it has started sampling 400G FR4 and 800G 2xFR4 receive optical engines (RXOEs).
Semiconductor Sputter Targets Forecasting Decline in 2023
Suppliers will benefit from slowdown as tight supply will be alleviated.
Flip Electronics Acquires Manufacturer of Obsolete Semiconductors Resurgent Semiconductor LLC
The acquisition will enhance Flip’s services and solutions portfolio to accomplish Flip’s mission of “Making Obsolescence Obsolete”.
Global Leader in microLED Manufacturing Orders Repeat Solstice S8 Single-Wafer Electroplating System from ClassOne Technology
Built on ClassOne’s Solstice platform, the system will be used at the customer’s new manufacturing site in Asia for high-volume production of next-generation microLEDs deployed in a range of end applications.
Device Manufacturers Turn to Talent Acquisition and Cross-Platform Software Development Tools to Fuel Productivity
Research from Qt reveals over a third (38%) of connected device manufacturers are experiencing delays in time-to-market, while 48% have been forced to raise prices.
Westerwood Global Acquires NSTAR Global Services
Workforce development and managed service solutions are rapidly becoming a vital element to meeting the growing talent shortage, particularly in high tech industries such as semiconductor.
Micron Appoints Raj Narasimhan as Senior Vice President and General Manager of the Compute and Networking Business Unit
Micron Technology, Inc. today announced the appointment of Raj Narasimhan to the role of senior vice president and general manager of its Compute and Networking Business Unit.
DB HiTek Expands High Value-Added Specialized Sensor
DB HiTek starts to expand high value-added specialized image sensor business with the foundry process technology specialized for global shutter and SPAD (Single Photon Avalanche Diode) which is in attention in various industries including automobile, robot and others.
Faraday Announces Multi-Site Manufacturing Support in ASIC
Faraday Technology Corporation, a ASIC design service and IP provider, today announced to offer multi-site manufacturing support across all regions for ASIC customers.
Cohu Acquires MCT Worldwide
Cohu, Inc., a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, today announced that it has acquired MCT Worldwide, LLC.
Toshiba Releases Automotive 40V N-channel Power MOSFETs with New High Heat Dissipation Package
Toshiba Electronic Devices & Storage Corporation has launched automotive 40V N-channel power MOSFETs.
Frank Powell, who is in charge of business development in semiconductor for Marposs, and Patrice Belin, product manager for STIL, a division of Marposs, talk to Semiconductor Digest editor Pete Singer about the company, its products and their applications. Marposs Company provides precision metrology equipment in the form of probes, in-process gauges and non-contact sensors for process control and monitoring. The STIL group adds chromatic confocal and interferometry technology to the line-up. Applications include ingot slicing, lapping/polishing/CMP, back grinding and machine monitoring. Chromatic confocal tech is used to produce high-accuracy bump measurements.
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CHIPS and Science Act 2022: Restarting the Flywheel
I’m excited that the CHIPS and Science Act was passed, and how it’s encouraged the return of semiconductor manufacturing to the US. We’ll be doing our best to keep the momentum going.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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