MAGAZINE
April/May 2021
Jim Hogan and Edward McCluskey Named Honorees of ESD Alliance and IEEE CEDA Phil Kaufman Hall of Fame
Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry.
Wafer Supply Constrained Through 2024 Likely
Will there be new greenfield projects to help with tightened capacity?
NVIDIA Announces Instant AI Infrastructure for Enterprises
NVIDIA today unveiled NVIDIA AI LaunchPad, a comprehensive program delivered through hybrid-cloud providers that gives enterprises immediate access to NVIDIA-powered infrastructure and software to streamline the entire AI lifecycle.
SiPearl Opens Site in Barcelona
SiPearl, the company that is designing the high-performance, low power microprocessor for the European exascale supercomputer, is opening its Barcelona office as the second operational subsidiary outside of France.
Kioxia’s AI Project Wins 2020 Field Innovation Award Silver Prize From Japanese Society for Artificial Intelligence
Kioxia Corporation announced today that it was awarded the 2020 Field Innovation Award Silver Prize by the Japanese Society for Artificial Intelligence (JSAI) for its TEZUKA 2020 project.
5 Key Vulnerabilities in the Semiconductor Supply Chain
There’s an ongoing push to strengthen the semiconductor supply chain, but making gains in that area is not as straightforward as some people initially believed. Here are five of the top vulnerabilities for the semiconductor sector to solve.
Park Systems Appoints Dr. Stefan Kaemmer as President, Park Systems Americas
“Park Systems is experiencing unprecedented expansion, and during the coming years we expect to add significantly to the revenue growth that put us at the One Trillion Mark at Kosdaq in 2021”, comments Dr. Sang-il Park, CEO & Founder of Park Systems.
Synopsys to Acquire Semiconductor and Flat Panel Display Solutions from BISTel
Synopsys, Inc. today announced that it has signed a definitive agreement to acquire the semiconductor and flat panel display solutions from BISTel, a developer of engineering equipment systems and AI applications for semiconductor smart manufacturing, headquartered in South Korea.
Dialog Semiconductor Achieves Industry’s Highest Ranking for IoTMark-Wi-Fi Benchmark
Dialog Semiconductor plc today announced that its DA16200 SoC has scored 815 on the EEMBC IoTMark-Wi-Fi benchmark.
Microchip Boosts GaN RF Portfolio with Ka-band Monolithic MMIC with High Linearity for SatCom Terminals
The new device, Microchip’s first GaN MMIC, is designed for use in commercial and defense satellite communications, 5G networks and other aerospace and defense systems.
STMicroelectronics Powers Wireless-Charging Growth with Secure Solution for Consumer and Automotive Qi-certified Chargers
STMicroelectronics (NYSE: STM) is protecting wireless charging of small devices and mobiles with a convenient solution for authenticating certified Qi chargers.
EV Group Launches Step-And-Repeat Mastering Services for Nanoimprint Lithography
EV Group announced that it has established the EVG Step-and-Repeat (S&R) Mastering Shop, a new service offering to help customers accelerate the deployment of nanoimprint lithography (NIL) in high-volume manufacturing.
Paving the Way for Smart Factories
Intel, EXOR International, TIM and JMA Wireless teamed together to build an end-to-end smart factory in Verona, Italy, as an example of the benefits of Industry 4.0 digitalization to manufacturers of all sizes.
ROHM Introduces Industry-first AC/DC Converter ICs in a Surface Mount Package with Built-in 1700V SiC MOSFET
ROHM Semiconductor today introduced the industry’s first AC/DC converter ICs with a built-in 1700V SiC MOSFET (BM2SC12xFP2-LBZ) in the TO263-7L package.
Winbond Unveils New 1.8V 512Mb SPI NOR flash for 5G and Other High-End Server Applications
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash.
Breathing New Life into Existing Tech: FT-IR Spectrometer Shows Molecular Orientation
Osaka Prefecture University observes the molecular orientation of thin-film materials with Fourier transform infrared spectroscopy (FT-IR) using an originally designed, 3D printed attenuated total reflectance (ATR) unit.
SIA Applauds Senate Introduction of FABS Act
The Semiconductor Industry Association (SIA) today applauded the introduction in Congress of the Facilitating American-Built Semiconductors (FABS) Act, bipartisan legislation that would establish an investment tax credit to incentivize greater semiconductor manufacturing in the United States.
Inducing and Tuning Spin Interactions in Layered Material
Magnetic-spin interactions that allow spin-manipulation by electrical control allow potential applications in energy-efficient spintronic devices.
Innovative Foundry Technologies Resolves Infringement Dispute with SMIC and Initiates New Patent Litigation
Innovative Foundry Technologies LLC (IFT) has resolved its patent dispute with Semiconductor Manufacturing International Corporation (SMIC).
AI System-on-Chip Runs on Solar Power
AI is used in an array of extremely useful applications, such as predicting a machine’s lifetime through its vibrations, monitoring the cardiac activity of patients and incorporating facial recognition capabilities into video surveillance systems.
New Manufacturing Technique for Flexible Electronics
Researchers at Stanford University have invented a manufacturing technique that yields flexible, atomically thin transistors less than 100 nanometers in length – several times smaller than previously possible.
Advantest Developing Innovative Methodologies for High-Speed Scan and Software-Based Functional Testing
Semiconductor test equipment supplier Advantest Corporation is pilot testing a next-generation solution for performing both high-speed scan testing and software-driven functional device testing on the V93000 platform by leveraging the existing high-speed serial I/O interfaces on advanced integrated circuits (ICs).
IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24%
Global IC market expected to exceed $500 billion for the first time.
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The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
Driving Fab Performance Metrics from the Sub-Fab to the Cleanroom
By Alan Ifould This is the 10th post to this blog in a year where change has been an overriding theme.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
IBM Announces 2nm GAA-FET Technology – the Sum of “Aha!” Moments
IBM likes to create a stir once in awhile, and judging by the tech-press response in the last week or three, they have achieved that goal with their announcement of 2-nanometer CMOS technology, developed at their Albany research centre. This technology is expected to give a 45% performance boost or 75% power reduction, compared with a 7-nm process. Of course the question is, compared with what 7-nm process?
