Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide Corning up to $32 million in proposed direct funding and Powerex up to $3 million in proposed direct funding.

Siemens Launches Innexis Product Suite

Siemens Digital Industries Software announced today the Innexis product suite, a complement to its Veloce hardware-assisted verification and validation system.

Dr. Ann B. Kelleher Named Dr. Lisa Su Woman of Innovation Award Recipient at WISH Conference

The Global Semiconductor Alliance (GSA) Women’s Leadership Initiative (WLI) announced the recipient of the 2024 Dr. Lisa Su Woman of Innovation Award: Dr. Ann B. Kelleher from Intel Corporation.

ROHM’s New 1200V IGBTs Achieve Industry-Leading Low Loss Characteristics with High Short-Circuit Tolerance

ROHM Semiconductor today announced new automotive-grade AEC-Q101 qualified 4th Generation 1200V IGBTs that combine class-leading low loss characteristics with high short-circuit resistance.

NVIDIA Names Ellen Ochoa to Board of Directors

NVIDIA today announced that it has named to its board of directors Ellen Ochoa, who was the former director of NASA’s Johnson Space Center in Houston, and the first Latina astronaut in space.

FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable High-Volume Manufacturing

FormFactor, Inc. and Advantest Corporation announced today a strategic partnership to develop a novel test cell and measurement system designed for high-volume production of silicon photonics (SiPh) and co-packaged optics (CPO) devices.

Fabrication of 4-inch Wafer-Scale Heterostructure via PECVD

KIMM achieves world’s first large-area semiconductor fabrication with TMDc and graphene heterostructure.

New PFAS Removal Process Aims to Stamp Out Pollution Ahead of Semiconductor Industry Growth

A University of Illinois Urbana-Champaign study is the first to describe an electrochemical strategy to capture, concentrate and destroy mixtures of diverse chemicals known as PFAS — including the increasingly prevalent ultra-short-chain PFAS — from water in a single process.

Heidelberg Instruments Reports Major Orders for the VPG+ 1400 FPD Volume Pattern Generator

Heidelberg Instruments has secured two major orders for its VPG+ 1400 FPD Volume Pattern Generator from leading photomask manufacturers in Asia, with a total order value between EUR 9 million and EUR 10 million.

Boston Materials Announces $13.5M in New Funding for Manufacturing Expansion and Establishing Supply Chain Partnerships

BOSTON MATERIALS, INC., a manufacturer of advanced materials key to the next generation of semiconductors and aircraft platforms, today announced $13.5 million in new funding.

ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool for Front-End Semiconductor Manufacturing

ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool.

MACOM Expands IC Design Expertise with Acquisition of ENGIN-IC

MACOM Technology Solutions Holdings announced today that it has acquired ENGIN-IC, Inc., a fabless semiconductor company that designs advanced Gallium Nitride monolithic microwave integrated circuits and integrated microwave assemblies located in Plano, Texas and San Diego, California.

Compound Semiconductor Materials Market Size to Surpass USD 60.75 Billion by 2033

Compound semiconductors are formed when two or more elements from separate or the same group on the periodic table are brought together and combined. Due to the increased demand for applications on electronic and mobile devices, it has experienced phenomenal growth over the past few years.

Empower Semiconductor Showcases Cutting-Edge Vertical Power Architecture for AI and HPC Processors at electronica 2024

Empower Semiconductor will demonstrate its new Crescendo platform with FinFast technology at electronica 2024, the world’s leading trade fair and conference for electronics.

Alchip Announces Successful 2nm Test Chip Tapeout

Joins the first wave of new semiconductor transistor architecture development.

European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem

The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.

MACOM Selected to Lead Advanced GaN-on-SiC Semiconductor Technology Development Project

MACOM Technology Solutions Inc. today announced that it has been selected to lead a development project to establish advanced gallium nitride (“GaN”) on silicon carbide (SiC) process technologies for radio frequency (“RF”) and microwave applications.

Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions

Arteris’ FlexNoC interconnect IP optimizes the on-chip communication flow supporting superior performance, power and area for advancing AI chip and chiplet computing.

CMP Ancillaries to Double in 2025

Recovery in wafer volumes and fab expansions to drive demand.

Pfeiffer Vacuum+Fab Solutions Introduces New Handheld Measuring Gauge

Pfeiffer Vacuum+Fab Solutions – a member of the Busch Group – introduces the TPG 202 Neo, a new Piezo/Pirani handheld gauge designed to meet the demands of various industrial and laboratory environments.

Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies

This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.

SIA Commends Selections for CHIPS R&D Flagship Facilities

The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.

First Annual SEMIEXPO Heartland Event to Assemble Leaders in Smart Manufacturing and Smart Mobility

With automotive electronics and Industry 4.0 serving as key semiconductor industry growth drivers, SEMI Americas’ inaugural SEMIEXPO Heartland event will gather key smart manufacturing and smart mobility stakeholders from April 1-2, 2025, at the Indiana Convention Center in Indianapolis.

Featured Video

At SEMICON West 2024, Advanced Energy further expanded on the theme of ‘Advancing the Angstrom Era’ by demonstrating its latest plasma power, high-voltage and critical temperature measurement and control technologies. Editor-in-Chief Pete Singer talked to Dhaval Dhayatkar, a Senior Director of Marketing of Plasma Power at Advanced Energy, about the company’s latest products, including new, modular platforms that meet demands for high power, high efficiency and power density AC-DC solutions across semiconductor processing and test equipment.

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