MAGAZINE
December
SmartDV and NSITEXE Sign Agreement
SmartDV Technologies, a supplier of Design and Verification Intellectual Property (IP), and NSITEXE, developer of advanced processors, today signed a multi-year agreement that enables SmartDV to license NSITEXE’s recently announced RISC-V-based, 32-bit CPU core to its customers.
America COMPETES Act of 2022 Is a Much-Needed Bill, but Not Sufficient to Compete with China, Says ITIF
Following the introduction of the America COMPETES Act of 2022 from the House of Representatives, companion legislation to the U.S. Innovation and Competition Act (USICA), which passed the Senate last June, the Information Technology and Innovation Foundation (ITIF), the leading think tank for science and technology policy, released the following statement.
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
CEVA, Inc. announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution.
Wooptix Introduces a Patterned Wafer Geometry System for 300mm Silicon Wafers
Wooptix SL will be presenting a new technique for Patterned Wafer Geometry at the upcoming SPIE Advanced Lithography conference on February 28th, 2022, in a paper published together with Applied Materials.
North American Semiconductor Equipment Industry Posts December 2021 Billings
After record-breaking billings of North America-based semiconductor equipment manufacturers in November 2021, December billings remained robust and were the second-highest ever.
Asymmetry is Key to Creating More Stable Blue Perovskite LEDs
For the first time, researchers have created blue LEDs using layers of metal halide perovskite linked with asymmetrical bridges, solving a critical instability problem.
SPIE and the University of Rochester Announce $1 Million Optics Graduate Fellowship
SPIE, the international society for optics and photonics, and the University of Rochester have announced the establishment of the SPIE Graduate Fellowship in Optical Sciences and Engineering.
Top Tier Semiconductor Supplier Qualifies Veeco’s Wet Processing System for Next Generation High Bandwidth Memory Applications
Veeco Instruments Inc. today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM).
SEMI Industry Strategy Symposium Europe to Spotlight Environmental Sustainability, Social Responsibility and Supply Chain Resilience
SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium, May 30, with insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry.
Kandou Expands into Silicon Glen
Kandou, a developer in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, officially opened its Silicon Glen office in East Kilbride, Scotland, today.
Weebit Nano Demonstrates Its First Crossbar ReRAM Arrays
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, announced that together with its development partner CEA-Leti, it has demonstrated its first operational crossbar arrays, a key milestone on the Company’s path to creating discrete (stand-alone) non-volatile memory (NVM) chips.
EV Group Recognized by Bosch as a Preferred Supplier of Semiconductor Equipment
EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status.
Addressing the Microchip Shortage
This country’s semiconductor chip shortage is likely to continue well into 2022, and a Georgia Tech expert predicts that the U.S. will need to make major changes to the manufacturing and supply chain of these all-important chips in the coming year to stave off further effects.
Harnessing Noise in Optical Computing for AI
A research team led by the University of Washington has developed new optical computing hardware for AI and machine learning that is faster and much more energy efficient than conventional electronics.
IC Sales Seen Growing by Double-Digits for Third Year in a Row
First three-year period of double-digit gains in 25 years, based on IC Insights’ forecast.
Trio-Tech Resumes Operations at Tianjin City Facility
Trio-Tech International today announced that it has resumed full operations at the Company’s Tianjin, China, facility.
Amcor Announces Strategic Investment in PragmatIC Semiconductor
In its continuing efforts to discover and develop innovative technologies for the packaging industry, Amcor announced today its strategic investment in PragmatIC Semiconductor.
Intel Announces Next US Site with Landmark Investment in Ohio
Intel will invest more than $20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.
NUS Research Team Sets New Efficiency Record for Solar Cell Technology
Their solar cells made using perovskite and organic materials achieve a power conversion efficiency of 23.6%, approaching that of conventional silicon solar cells.
DuPont Completes New Production Line in Circleville, Ohio
DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, today announced it has completed the expansion project at its Circleville, Ohio manufacturing site.
Samco Unveils New Plasma Etching Cluster Tool for Compound Semiconductor Device Fabrication
Samco, a manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new plasma etching cluster tool “Cluster H.”
Intevac Appoints Nigel Hunton as Chief Executive Officer
Intevac, Inc., a supplier of thin-film processing systems, today announced the appointment of Nigel Hunton as president and chief executive officer (CEO), and member of the board of directors, effective January 19th.
Quantum Tech: Semiconductor ‘Flipped’ to Insulator Above Room Temp
A semiconducting material that performed a quantum “flip” from a conductor to an insulator above room temperature has been developed at the University of Michigan.
CyberOptics’ new WX3000 Metrology and Inspection system, which Incorporates the company’s NanoResolution Multi-Reflection Suppression™ (MRS™) sensor, enables the combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging. At SEMICON West, Subodh Kulkarni, President and CEO, explains how it works and what’s new in the company’s other product lines.
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The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
Sustainability in Semiconductor Manufacturing – A Review of Emissions and Materials Released Off-Site
By Chris Jones, Edwards Vacuum In the last post to this blog, we introduced the theme of sustainable manufacturing, which will be our ongoing focus. We described the evolving framework for limiting carbon emissions and reviewed the vocabulary we will use going forward. This post will briefly overview the materials released off-site during semiconductor manufacturing – what they are, where they come from, and where they go.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
AMD, Intel Display Chiplet Packaging Prowess
Last November AMD held their AMD Accelerated Data Center Premiere, Intel had their Innovation Days, and Stephen Shankland of CNET visited Intel’s fabs 42 and CH-4 in Chandler.
