TECHCET—the electronic materials advisory firm — announced a heightened need for plating chemistries consumed in advanced packagiing & FE/damascene driven by huge growth in chips in all sectors. This includes plating chemicals for copper (Cu), nickel (Ni), tin (Sn), and silver (Ag). Total copper plating chemicals are expected to grow 14.2% in 2021 to total $662M USD, with advanced packaging rising almost double that of damascene. Advanced packaging applications include Cu pillar, Redistribution Layer (RDL), and Through Silicon Via (TSV).
Advanced logic is the main driver of growth for plating materials. Used for damascene, copper plating chemicals volume demand increases with each new logic generation. Although CVD or PVD Cobalt (Co) and & Ruthenium (Ru) are starting to be used in M0-M4 layers, overall growth in advanced logic and the number of layers pushes up Cu plating revenues for advanced logic applications. Advanced logic nodes (<> 16nm) wafer starts are forecasted to increase 14.4% CAGR (2020-2025); however, the number of damascene steps required for all leading-edge device wafer starts is expected to increase by more than 50% annually.
Although strong growth is expected throughout the forecast period, TECHCET anticipates a slowing in growth by 2023. “In another couple of years, we anticipate an inventory correction which should slow the pace of growth in devices and moderate demand for plating chemicals,” stated Dan Tracy, Sr. Director of TECHCET. However, by 2025, another upturn is expected.