Jenoptik’s new UFO ProbeTM technology targets the market for semiconductor equipment and processes for wafer-level testing in microelectronics. The technology is based on a concept for optical probing of photonic integrated circuits, which is insensitive to alignment tolerances in the wafer prober. As consequence, the opto-electronic probe card can be used with commercially available wafer probers and ensures an accordingly high throughput for testing photonic integrated circuits.
The new hybrid probe card combines electrical and optical tests in one solution. This allows multiple optical and electrical channels of a PIC or even several PICs to be tested in parallel, regardless of their arrangement, thus meeting the demand of opto-electronic tests for high-volume applications. The design of the probe card can be customized to meet specific requirements, such as individual PIC layout and specific test arrangement. The first series run was successfully measured with this new technology.
Jenoptik is working with probe card manufacturers to integrate the optical module into established and proven needle technologies. The first platform version of UFO ProbeTM is available in Eurocard format with cantilever needles and can be adapted to different applications if required. Here, the customer benefits from rapid development with customer-specific features.