MEMS and Sensors Tap AI, Blockchain, Machine Learning to Boost Personalization in Biomedical, Food Supply, IoT

MSIG MEMS & Sensors Executive Congress to feature business leaders examining market opportunities, innovations and technology trends.

Senior executives from across the MEMS and sensors supply chain will gather at MEMS & Sensors Executive Congress (MSEC), October 22-24, 2019, in Coronado, Calif. for the latest innovations driving widespread adoption of these tiny smart devices. Recent MEMS and sensor leaps support more personalized user experiences in biomedical/healthcare, the food supply chain, and Internet of Things (IoT). MSEC is hosted by the MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner. Registration is now open with early-bird pricing available until September 20, 2019.

MSEC comes as manufacturers plan to embed more than 50 billion MEMS and sensors in thousands of applications by 2024 to meet consumer demand for more intelligence and interactivity in electronic products, according to Yole Développement. Featured speakers at MSEC will examine the enabling role of MEMS and sensors in diverse intelligent applications.

MSEC Keynotes and Other Speakers

Albert Pisano, professor and dean, UC San Diego, will explore how MEMS will enable development of large-scale sensor-driven systems in smart cities, spanning healthcare, transportation, retail and education. 

Stefan Finkbeiner, CEO and general manager, Bosch, will explain how software synthesis and artificial intelligence (AI) will enable MEMS-enabled consumer-electronic devices to automatically adapt to users.

Pete Warden, staff research engineer, Google, will describe how low-power, low-cost machine learning (ML) will enable hundreds of billions of embedded devices to turn raw sensor data into actionable insights.

Rachel Gabato, COO, ripe.io, will describe how sensors, AI, ML and blockchain technology underpin a radically transparent digital-food supply chain that maps foods’ journey from production and transportation to the dinner plate.

John Smee, VP of engineering, Qualcomm, will explain enhancements to 5G Near Radio (NR) that will enable higher performance and more reliable connectivity in industrial IoT, vehicle-to-everything (C-V2X), and massive IoT devices (MIoT).

Additional MSEC Speakers

Other MSEC Highlights

Exit mobile version