Reno Sub-Systems (Reno), a developer of high performance Radio Frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today introduced Velocity™ Multi-level RF matching technology, the first technology that can match process impedance changes in microseconds and match sequential multiple power levels with precision. Benefits of this approach include plasma stability, accurate power delivery, and fast tuning for accelerated processing times. The new technology targets manufacturing nodes at or below 10nm.
“Reno continues to dominate the industry with our novel and inventive technologies to advance subsystem performance to meet the needs of next-generation semiconductor manufacturing,” said John Voltz, senior vice president, business development at Reno Subsystems. “With orders of our Velocity Matching Networks steadily growing over the past year, technology advances like the level-to-level matching capability truly move the bar for subsystem performance and are exclusive to Reno’s products. We’re already working with customers to integrate this new approach into their volume production environments.”