Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch International will headline the event with keynotes. Event registration is open.
The 3D & Systems Summit will showcase prominent players in 3D integration for microelectronics manufacturingwhileofferingbusiness-to-business matchmaking, networking for participants to explore new partnerships, an exhibition, and a gala dinner.
SEMI 3D & Systems Summit Keynotes
Jan Vardaman, President and Founder, TechSearch International Inc.
Vardaman will kick off the summit with her keynote A New Era for 3D. Vardaman will discuss the latest developments and trends in areas including three-layer image sensors, Samsung’s three-layer stack, new packaging technologies with active interposers, Foveros 3D integration technology for heterogeneous system integration, 3D and SoIC face-to-face stacking, Wafer-on-wafer (WoW) and High Bandwidth Memory (HBM).
Eelco Bergmann, Senior Director, Strategic Sales and Business Development, ASE Group
Leading day two with his keynote Integration Technologies Transforming the World, Bergmann will explore how System-in-Package (SiP) technologies are delivering on their promise of miniaturization, power efficiency and high performance. The timing of his keynote is ripe as the electronics industry, largely driven by semiconductor innovation, is enabling life-changing applications from health to mobility and from virtual reality to AI.
Dr. Doug Yu, Vice President of Integrated Interconnect and Packaging, TSMC
In his presentation SoIC – A Longtime Game Changer, Yu will present research and development of advanced packaging and system integration solutions, System on Integrated Chips (SoICTM) and their derivatives, TSMC’s wafer-level system integration technologies, Chip on Wafer on Substrate (CoWoS®), and Integrated Fan-Out (InFO).
Mustafa Badaroglu, Technical Director, Huawei Technologies
In his talk 3D IC Opportunities for High-performance Computing, Badaroglu will explore trends in intelligent data connectivity, HPC, how sensors are driving energy-efficiency for computing, connectivity bandwidth, and new assembly and integration schemes such as 3D integration for energy-efficient machine learning computation.