StratEdge Corporation will display its thermally-efficient packages at CS MANTECH in booth 17. These packages enable semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS.
StratEdge designs and manufactures high-performance semiconductor packages as well as provides chip assembly, including industry leading automated, gold-eutectic die attach services. StratEdge manufactures a complete line of post-fired and molded ceramic packages operating from DC to 63+ GHz, many containing thermally conductive bases with co-efficient-of-thermal expansions matched to compound semiconductors. StratEdge specializes in packaging high-frequency and very high-power gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) semiconductors.
“StratEdge has over thirty years’ experience making packages for compound semiconductors and has regularly attended CS MANTECH since its inception,” said Tim Going, president of StratEdge. “Our patented technology has delivered superior electrical performance for GaN, GaAs, and other compound semiconductor devices, while providing mechanical stability for these sensitive devices.”
CS MANTECH is being held May 9-12, at the Monterey Marriott in Monterey, CA.