Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leader in semiconductor assembly and testing has placed a multi-system order for its AP300 Lithography System for the production ramp of advanced packaging chips. The advanced packaging devices will be used to meet increasing demand for 5G system-on-a-chip, graphic processors (GPUs) and high performance computing applications.
The AP300 systems were selected based on its uptime and performance with lower total cost of ownership. This purchase is indicative of accelerating market demand for Veeco’s lithography systems, given the tools’ ability to handle next-generation advanced packaging process needs including copper (Cu) pillar, wafer-level packaging (WLP), fan-out WLP (FOWLP) and 3D integrated circuit developments.
“Global megatrends such as graphic processors used in gaming and crypto mining, autonomous driving and high performance computing related to internet-of-things and artificial intelligence are driving strong demand for technologies that enable advanced packaging,” commented Adrian Devasahayam, Ph.D., Senior Vice President, Product Line Manager. “As integrated packaging designs gain momentum, customers require a lithography platform that can handle all advanced packaging process needs with superior process at the lowest cost of ownership. Our AP300 platform provides that solution for the challenging advanced packaging processes for high-performance, next-generation devices.”