XTPL, provider of dispensing technology for microelectronics, will be an exhibitor at the productronica 2023 fair, the largest single event for electronics manufacturing in Europe. During the event, the company will showcase the capabilities of its patented Ultra-Precise Dispensing (UPD) technology, which enables electronically conductive or insulating structures to be printed on a wide range of substrates with unprecedented precision. This technology has just become available to the industrial market, offering unprecedented precision in mass production.
This year’s productronica will take place from 14-17 November in Munich, Germany. XTPL, at its booth located in Hall B2.119, will be demonstrating its groundbreaking Ultra-Precise Dispensing technology, which has the potential to revolutionize manufacturing of microelectronics. UPD traces the way for developing solutions that were previously impossible to accomplish. After a very successful market entry of Ultra-Precise Dispensing technology in the Delta Printing System – a stand-alone machine for prototyping and low-series production, XTPL now enters with its technology into manufacturing lines of modern electronics.
XTPL offers Ultra-Precise Dispensing System, which is a single nozzle solution tailored for the integration with manufacturing equipment for production lines of advanced electronics. The high precision dispensing system of XTPL significantly impacts two major application fields: heterogeneous integration and yield management and has the potential to complement conventional techniques in microelectronics manufacturing. This means that the unprecedented precision in the 0.50-10 micrometre range offered by XTPL can be used on a mass scale across many industries.
“Advancements in microelectronics are transforming how we connect and perceive the world around us. XTPL provides ultra-precise dispensing technology for microelectronics, which answers the demands of additive manufacturing and constant microelectronics miniaturization. We are focusing on four market segments including consumer electronics with rapidly developing VR technology, healthcare industry, next-gen displays for automotive and airspace industries and research institutes. – said – Filip Granek CEO at XTPL.
The UPD technology allows ultra-precise dispensing of conductive traces over the edge, facilitating the integration of heterogeneous elements, enabling the integration of various electronic components or devices into a single system or package. It provides flexibility, miniaturisation, and improved performance in diverse applications ranging from flexible electronics to wearable devices, microelectronics packaging, IoT systems, and biomedical applications.
It also provides ultra-precise dispensing of conductive microbumps for 3D integrated circuits, advanced packaging, or system-on-chip designs, where compact and high-density interconnections are essential. The controlled and precise placement of microbumps (below 50 um diameter) allows for improved performance, increased functionality, and reduced form factor in heterogeneous systems.
Moreover, UPD technology allows ultra-precise dispensing of conductive or insulating material to the microvias for advanced packaging techniques like flip-chip and through-silicon via (TSV) technologies to establish connection between different layers facilitating communication between stacked components or dies. Via filling enables efficient connections, thermal management, and miniaturization, providing enhanced functionality and performance in advanced packaging applications.
Finally, UPD offers ultra-precise dispensing of conductive interconnections with microLEDs enabling their integration into heterogeneous microelectronic systems. The interconnections facilitate the control, driving, and power distribution to the microLEDs, ensuring their proper functionality within the overall display system and opening up possibilities for applications such as AR/VR devices, smartwatches, automotive displays, and more.
“The UPD Technology, used by both DPS and UPD System, is groundbreaking for several reasons. Firstly it guarantees unprecedented precision in the 0.50-10 micrometer range, in which we are practically unrivaled. Secondly, it is an additive method, which allows significant time and material savings. Moreover, it offers scalability, cost-effectiveness, simplicity and speed and all the above can be printed without the need to use an electric field.
This solution finds application in the broadly understood additive manufacturing industry with a particular focus on microelectronics and microelectronics component manufacturers, including, but not limited to OLED and MicroLED displays, semiconductors, advanced PCBs or in the healthcare industry. UPD technology can also be used in R&D departments and development and academic centers working on solutions using additive micro-scale printing technology.