As the heartbeat of intelligent, connected electronics, precision timing will play a key role in 2025’s expansion. Precision timing will drive innovation across industries like healthcare, manufacturing, FinTech, and cybersecurity.
Semiconductors
2025: MEMS Move to 300mm
The move to 300mm wafers as a substantial leap forward for the MEMS industry in manufacturing automation and cost-effectiveness, yet many challenges remain.
2025: Photonic Integrated Circuits – Driving Quantum Technology
Innovations around photonic integrated circuits (PICs) have the potential to transform our ability to meet the demands of our increasingly data-driven world.
2025: Optimizing Automated Test Equipment for the Era of AI and Beyond
The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.
2025: Advancements in Litho Technologies Enabling Next-Generation Multi-Chip Systems
As advanced packing gains momentum, the industry will be looking to novel, creative processing solutions to handle the integration imperatives of today – and tomorrow.
2025: The Future is Bright for the Photomask Industry
Increasing investments in critical photomask infrastructure yields benefits for the entire mask-to-wafer ecosystem.
2025: AI is the Driving Force
This year continues to anticipate the impact of AI as the driving force behind optimism in our industry.
2025: New Packaging Approaches Drive Cost and Efficiency
The fast adoption of chiplets will continue to drive wafer-level packaging (WLP) growth in 2025, as semiconductor companies continue to invest in various types of packages for diverse applications.
2025: Opportunities Abound for Semiconductor Equipment
As we look ahead to 2025, we’re seeing three major trends: a growing compound semiconductor market, the resurgence of wet bench technology and growing workforce development needs.
2025: A Paradigm Shift in Wire Interconnection
The drive towards high density (HD), ultra-high density (UHD) and alternative substrates, including glass, will be transformative for North American wire interconnection manufacturing in 2025.
