MAGAZINE
August/September
GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding
GlobalFoundries announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
Synopsys Unveils Industry’s Broadest Portfolio of Automotive-Grade IP on TSMC’s N5A Process Technology
Today, Synopsys, Inc. announced the industry’s broadest portfolio of automotive-grade Interface and Foundation IP for TSMC’s N5A process.
Purdue’s Semiconductor Innovation Ecosystem Grows With CHIPS-funded, Indiana-led Semiconductor Hub With Upcoming Summit
Purdue University continues building momentum as America’s leading university in semiconductors, with a broad range of updates this fall semester.
Samsung Electronics’ Industry-First LPCAMM Ushers In Future of Memory Modules
Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed system verification through Intel’s platform.
Semiconductor Supply Chain Problems Running Rampant?
Solutions to mitigate future materials supply vulnerabilities.
Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
Synopsys, Inc. today announced its analog design migration flow is enabled across TSMC’s advanced process technologies, including N4P, N3E, and N2.
SEMI North America Advisory Board Welcomes New Members From Axcelis, Edwards Vacuum, Lam Research and Teradyne
SEMI today announced the election of four new members to the SEMI North America Advisory Board.
Lam Research Supports Youth from 200 Countries to Compete in Pioneering Innovation Challenge Addressing Climate Change
The 2023 FIRST Global Challenge will in a few weeks bring together thousands of teens from across the globe to compete in robotics and collaborate to find renewable energy solutions.
Omdia: Manufacturers from China Have Increased Their Dominance in the Auto Display Market, Holding a 45% Market Share in 1H23
Chinese companies have emerged as the top suppliers in the automotive display market in the first half of 2023, extending their dominance in the displays industry after also dominating the TV and smartphone display markets.
Photo electron Soul Signs Capital and Business Partnership with USHIO
Photo electron Soul Inc., a startup company launched by Nagoya University, announced today that it has raised 730 million yen from a group of general partners led by USHIO INC. and concluded a sole-distributor agreement with USHIO for the semiconductor photocathode e-beam generation systems incorporated into e-beam semiconductor wafer pattern inspection tools.
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
With $3.1 billion spending ceiling, new 10-year contract provides U.S. Dept. of Defense an assured supply of securely manufactured semiconductors for use in the nation’s most sensitive applications.
FPT and Silvaco Ink Deal, Advancing Semiconductor Workforce and Business Expansion
FPT Semiconductor, a subsidiary of FPT Corporation (FPT), today announced its partnership with Silvaco, US-based leading provider of TCAD, EDA software, and Design IP, aiming at fostering workforce and business growth in the semiconductor sector.
Samco Plasma Etching System RIE-10NR Updates University of Illinois Urbana-Champaign’s Material Research Lab
Samco reveals plans to install plasma etching system RIE-10NR early 2024 as the newest update to the Materials Research Lab (MRL) at the University of Illinois Urbana-Champaign (UIUC).
Linx Consulting to Host Conference and Workshop this November
The Electronic Specialty Gases & Systems Conference 2023 will be held November 14 to 16, 2023 at Gila River Resorts in Chandler, AZ.
Wearable Optical Device Shows Promise for Detecting Postpartum Hemorrhage
Researchers use laser speckle imaging to provide early warning for a common cause of maternal mortality.
NXP Honored with Prestigious Automotive Awards
NXP Semiconductors N.V. announced that it has been honored by three automotive partners.
Purdue Center Addresses Pressing Challenge of Securing Semiconductor Chips
Purdue University’s emergence as a leader in semiconductor chips also requires it to usher in a new level of security that protects those essential chips needed for everything from your car and cellphone to artificial intelligence and machine learning.
MITRE Responds to CHIPS Act Awards for Eight Regional Innovation Hubs
Yesterday, the Department of Defense (DoD) announced the first set of awards under the CHIPS Act totaling nearly $240 million to build eight regional innovation hubs through its Microelectronics Commons initiative.
Deputy Secretary of Defense Kathleen Hicks Announces $238M CHIPS and Science Act Award
Deputy Secretary of Defense Kathleen Hicks announced the award today of $238 million in “Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act” funding for the establishment of eight Microelectronics Commons (Commons) regional innovation hubs.
ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions
The introduction of Generative AI (GAI) has significantly increased the demand for advanced semiconductor chips, drawing increased attention to the development of complex calculations for large-scale AI models and high-speed transmission interfaces.
Cadence to Acquire Intrinsix Corporation from CEVA
Cadence Design Systems, Inc. and CEVA, Inc., a licensor of wireless connectivity and smart sensing technologies, today announced that they have entered into a definitive agreement for Cadence to acquire Intrinsix Corporation, a wholly owned subsidiary of CEVA and a provider of design engineering solutions focused on the U.S. aerospace and defense industry.
SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain’s Carbon Emissions
The SEMI Semiconductor Climate Consortium (SCC) today issued its first report of the semiconductor ecosystem’s greenhouse gas (GHG) emissions profile, an in-depth analysis of the semiconductor value chain’s carbon footprint and priority-ranked carbon emission sources for the industry to address.
Omdia: Large-Area Displays Expected to See Further Decline in Unit Shipments by 7.3% YoY While Area Shipments Increase by 0.5% YoY in 2023
Previous forecasts that large-area displays, including both LCD and OLED shipments, will decrease by 3.2% year-over-year (YoY) in 2023 has now been decreased further to -7.3% YoY in the latest forecast owing to deeper demand erosions and panel makers’ utilization management.
Featured Video
Cooling technology giant Trane was at SEMICON West 2023, and Editor-in-Chief Pete Singer talked with Andy Alcorn, Senior Director of Global Accounts about the company’s sustainability goals and how they are helping semiconductor manufacturers meet goals related to decarbonization, Scope 1, 2 and 3 emissions, supply chain resiliency, water consumption and energy efficiency.
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Update: China May Win in AI Computing
Leveraging hybrid bonding as an alternative to dimensional scaling.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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