In this Issue:

EDITORIAL: Rethinking University Research

NEWS

DATA ANALYTICS: Navigating Semiconductor Manufacturing Complexity with Data-driven Insights

DATA ANALYTICS: How Machine Learning Is Improving Semiconductor Operations

LITHOGRAPHY: Curvilinear Technology: A Game Changer for the Logic Technology Roadmap

ADVANCED PACKAGING: Advanced Interconnect Process Control with Picosecond Ultrasonic Technology for AI Device Packaging

TEST: Optimizing Tester Memory Resources with Xtreme Pooling Technology

BUSINESS: CHIPS Act and R&D: Who Will Pay for Leading Edge?

THERMAL MANAGEMENT: Custom Thermal Management Solutions for Semiconductor Process Equipment

MATERIALS: Engineered for Excellence: Advanced Materials in Semiconductor Fluid Delivery Systems

DISPLAYS: The Role of 5G and Edge Computing in Self-Service Kiosks

INDUSTRY OBSERVATION: A Collaborative Supply Chain Won’t Just Grow Business — It’ll Accelerate Global Innovation

INDUSTRY OBSERVATION: Reducing Scope 2 Emissions in Semiconductor Manufacturing — A Happy Coincidence

INDUSTRY OBSERVATION: New Techniques Hold the Key to Mitigating Environmental, Human Health Impacts

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