MIRA XR: New Ultra-High-Resolution SEM-EDS Solution by TESCAN GROUP

TESCAN GROUP introduces the MIRA XR, an ultra-high-resolution SEM-EDS solution designed for fast, precise materials analysis in academic research and quality control environments.

TESCAN GROUP introduces the MIRA XR, an ultra-high-resolution SEM-EDS solution designed for fast, precise materials analysis in academic research and quality control environments.

Designed to bridge the gap between conventional FEG SEMs and ultra-high-resolution (UHR) systems, MIRA XR offers analytical flexibility, ease of use, and streamlined workflows for both industrial and research applications.

Precision, Speed, and Versatility for Industry & Research

MIRA XR is engineered for high-throughput environments, including quality control, metallurgy, battery research, and semiconductor failure analysis, where both speed and imaging accuracy are critical.

A New Balance Between Resolution and Usability

“With MIRA XR, we’ve created a solution optimized for demanding users seeking advanced imaging performance combined with ease of operation,” said Jean-Charles Chen, TESCAN GROUP CEO. “Our customers now have a SEM that delivers resolution at nanoscale, productivity and analytical versatility for multi-user environment.”

“We listened to customer feedback and designed a system that optimizes every step of the workflow. Introducing MIRA XR, featuring MIRA-optimized BrightBeam™ technology for exceptional low-keV imaging performance, with a focus on minimizing time to data. MIRA XR allows operators to focus on their samples, rather than instrument adjustments, ensuring a faster, more seamless path to high-resolution insights,” adds Bruno Janssens, Chief Strategy Officer of TESCAN GROUP.

Key Advantages of MIRA XR:

Launch Webinars & Product Demonstrations

To showcase MIRA XR’s capabilities, TESCAN Group has scheduled a series of events and webinar for industry and academia.

Webinar:

Microscopy congresses:

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