Solid State Technology Content Now Available

I’m delighted to report that the content from Solid State Technology is now available through the Semiconductor Digest website. Gold Flag Media LLC, co-founded by Kerry Hoffman and Pete Singer in 2019, acquired the Solid State Technology internet domains electroiq.com and solid-state.com plus all associated content late last year and we are delighted to announce that we have successfully transferred the entire contents of the vast SST library to our site.

Readers can find content using the search function on the dedicated archival site, download entire issues in PDF format, use the topic index keyword list, or navigate through various topic centers.  

Solid State Technology, which was founded in 1959, began posting content on the internet in the mid-1990s. Readers can now find every issue going back to 1996 and almost 34,000 posts covering news and technology developments from 1995 through early 2019.

This treasure trove of information also includes the archives of Advanced Packaging magazine, Small Times magazine and Clean Rooms magazine.

In case you missed them, feature articles from the last several issues of Solid State Technology are also now available in html format:

 Monitoring for excursions in automotive fabs

The Process Watch series explores key concepts about process control defect inspection, metrology and data analytics for the semiconductor industry. This article is the fourth in a series on process control strategies for automotive semiconductor devices.

Scalable SONOS based embedded non-volatile memory technology

SONOS (Si-Oxide-Nitride-Oxide-Si) based eNVM technology is well-suited for System-On-a Chip (SOC) products as they are very compatible with standard logic/mixed-signal CMOS process flow. This paper describes how the SONOS based eNVM technology has been successfully developed and scaled down to 28nm node.

The ASOPS system as a multiphysics measurement device for research and industry

Insights into the rise of ASynchronous OPtical Sampling technology as a future measurement standard and how it can be used in the industry.

Recovery and recycling of process gases: What are the options?

Any consideration of recycling must take a systems-level approach, thoroughly considering all predictable and potential costs, including risks of downtime, contamination and safety.

Overcoming challenges of futuristic transistor technology below 5nm node

The potential transistor structures and materials like Carbon Nano-tube FET, Gate-All-Around FET, and compound semiconductors as solutions to overcome the problems of scaling the existing silicon FinFET transistor below 5nm node are reviewed.

Sensors in the new age of the car

Sensors are inextricably linked to the future requirements of partially and fully autonomous vehicles.

New Thinking Required for Machine Learning

Speakers at the VLSI Symposium argued the semiconductor community thus far has not been doing enough to enable machine intelligence.

AI Chips: Challenges and Opportunities

To get to the next level in performance/Watt, innovations being researched at the AI chip level include low precision, analog and resistive computing.

OASIS vs GDS: Time to switch?

The Open Artwork System Interchange Standard (OASIS®) format, which can reduce both file sizes and loading times. The OASIS format has been available for almost 15 years and is accepted by every major foundry. It is also supported by all industry standard EDA tools.

There’s still plenty of room at the bottom: Isotopically pure materials for when every atom counts

When different isotopes of atoms have significantly different properties, the ability to create isotopically pure materials becomes essential.

Emerging memories for the zettabyte era

The scaling of traditional memories such as SRAM, DRAM and Flash is no longer following the data growth rate, especially in terms of energy and speed.

Dynamic Fault Detection: Utilizing AI and IoT to revolutionize manufacturing

A new approach, Dynamic Fault Detection (DFD) was developed to address the shortcomings of traditional FDC systems and save both production time and engineer time.

Perfecting yield with proactive optimization throughout the process and across the supply chain

Proactive yield perfection (PYP) is a comprehensive systems-level approach to perfecting yield through detailed surveillance and sophisticated modeling that identifies actual or potential root causes of excursions.

Process Watch: Automotive defect sensitivity requirements

Semiconductors continue to grow in importance in the automotive supply chain, requiring IC manufacturers to adapt their processes to produce chips that meet automotive quality standards.

Overlay performance of through silicon via last lithography for 3D packaging

A lithographic method for TSV alignment to embedded targets was evaluated using in-line stepper self metrology, with TIS correction.

Layout schema generation: Improving yield ramp during technology development

Layout schema generation generates random, realistic, DRC-clean layout patterns of the new design technology for use in test vehicles.

A special thanks to our web developer Slava Dostenko for his work in keeping this content secure as we worked through the long acquisition process.

Exit mobile version