Propelled by 51% share of IDM sales and 65% share of fabless sales, U.S. companies captured 55% of the total worldwide IC market in 2019.
The recent surge of the spread of the coronavirus (Covid-19) and its anticipated negative impact on the global economy and IC market definitely fits the definition of a Black Swan event.
A room-temperature bonding technique for integrating wide bandgap materials such as gallium nitride (GaN) with thermally conducting materials such as diamond could boost the cooling effect on GaN devices and facilitate better performance through higher power levels, longer device lifetime, improved reliability, and reduced manufacturing costs.
A critical element to successful IoT security chips is public key infrastructure (PKI). All IoT devices with these chips require a strong identity, which will then be used for secure authentication.
The global market for Photoresists and Ancillary Materials declined in 2019 due to semiconductor fabrication market challenges.
Though growth rates in some product categories have slowed, doubling of transistors per chip every two years remains a guideline that the industry continues to follow.
Though rising 7%, total semiconductor units forecast to fall short of all-time record.
This week, at the SPIE Advanced Lithography Conference, imec and ASML announce a breakthrough in printing narrow 24 nanometer (nm) pitch lines, corresponding to the dimensions of critical back-end-of-line metal layers of a 3 nm technology node process.
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, has begun mass production.
Leaders in memory IC and foundry production maintain strongest capacity presence.