Autonomous driving systems are extremely complex; they tightly integrate many technologies, including sensing, localization, perception, decision making, as well as the smooth interactions with cloud platforms for high-definition (HD) map generation and data storage.
Experts at BrainChip offered new insights and considerations for the use of transfer learning and incremental learning in edge AI/IoT environments.
At SEMICON Southeast Asia 2021, Mr. Terence Gan, SVP, Semiconductors, Economic Development Board (EDB) of Singapore, outlined five research pillars.
ACM’s Ultra ECP GIII plating tool is designed for WLP for compound semiconductors, with product offerings for SiC, GaN and GaAs. The tool is also capable of plating gold into backside deep hole processes with greater uniformity and better step coverage.
At the annual Hot Chips conference, IBM unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time.
Samsung’s revelations at Hot Chips include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory.
Semiconductor design has progressively improved over the decades, and that will continue for the foreseeable future. Here are some fascinating trends that will likely shape the future of engineering at all stages of product development.
The shortage of semiconductors won’t be easy to solve, with some equipment lead times stretching out several years, said VLSI Research CEO Dan Hutcheson at a SEMI event.