Demand for AI-Optimized Chipsets to Spur Requirements for Hybrid Bonding

Compared with other methods, hybrid bonding offers inherent advantages in high-density IO (input- output), reduced parasitic delay, shorter height and improved thermal performance.

Smart Mobility, Despite Challenges, to Drive Industry’s Growth

Dogged by controversy, smart mobility faces technical, regulatory challenges, experts said at a Smart Mobility panel at 2022 SEMICON West.