The ‘Blank Sheet’ that Delivered Intel’s SoC Design Change

Rethinking chip architecture from the ground up is no small feat. Intel Core Ultra is Intel’s biggest SoC design change in 40 years, and Wilson, a 22-year Intel veteran, says it took a unique team with a massive breadth of expertise.

Demand for AI-Optimized Chipsets to Spur Requirements for Hybrid Bonding

Compared with other methods, hybrid bonding offers inherent advantages in high-density IO (input- output), reduced parasitic delay, shorter height and improved thermal performance.