Two new reconstruction technologies introduced today by ZEISS use Artificial Intelligence (AI) to improve data collection and analysis, and speed up decision-making significantly.
The City of San Diego has honored Kyocera International, Inc. for 50 years of U.S. manufacturing.
AKHAN Semiconductor showcased the ability to manufacture 300mm complementary metal–oxide–semiconductor (CMOS) diamond wafers.
New location expands Brooks Instrument’s production, service and applications engineering capabilities, providing enhanced support to key customers in the region.
Worldwide silicon wafer area shipments increased 6% to 3,534 million square inches in the second quarter of 2021, surpassing the historical high set in the first quarter.
Wooptix SL, a Spanish company dedicated to developing new imaging solutions, has introduced Phemet® lab system, a 300mm blank silicon wafer geometry system collecting millions of topography data points on a full wafer in a few seconds.
While China’s share of all semiconductor production has shot up, the Americas region has declined, raising alarm bells in Washington. “We see a continuation of this trend, with the Americas dropping by one more percent point next year and China building out its lead.” – SEMI senior principal analyst Christian Dieseldorff.
Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, today announced the close of a $71m Series D round of funding.
Today’s energy-efficient electric charging systems powering commercial vehicle propulsion, as well as auxiliary power systems, solar inverters, solid-state transformers and other transportation and industrial applications all rely on high-voltage switching power devices.
ClassOne Technology announced that it has received multiple tool orders from one of the world’s largest RF device manufacturers.
STMicroelectronics today announced it has manufactured the first 200mm (8-inch) Silicon-Carbide (SiC) bulk wafers for prototyping next-generation power devices from its facility in Norrköping, Sweden.
North America-based semiconductor equipment manufacturers posted $3.67 billion in billings worldwide in June 2021, according to the June Equipment Market Data Subscription (EMDS) Billings Report published by SEMI.
A look at current market dynamics and the emergence of DDR5, 1-alpha process node, and CXL. Find the full article in the June/July issue of Semiconductor Digest.
STMicroelectronics has expanded the variety of machine-learning techniques available to users of the STM32Cube.AI development environment, giving extra flexibility to solve classification, clustering, and novelty-detection challenges as efficiently as possible.
DesignCon, the event in high-speed communications and system design, today announced a new raft of speakers confirmed for the 2021 edition of DesignCon, set for August 16-18 at the San Jose McEnery Convention Center.
Integrated Biometrics (IB), a developer of mobile FBI-certified biometric fingerprint scanners, today announced industry veteran Shawn O’Rourke has been named chief executive officer following the retirement of former CEO Steve Thies.
Epson presented Mouser’s Ben Venator and Melinda Harper with the award for continued increases in market share and customer count.
Skyworks Solutions, Inc. today announced that it has completed its acquisition of the Infrastructure & Automotive business of Silicon Laboratories Inc.
Winbond Electronics today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory.
Cadence Design Systems, Inc. today announced the delivery of the Cadence Cerebrus Intelligent Chip Explorer, a new machine learning (ML)-based tool that automates and scales digital chip design.
The SIA – along with a broad coalition of 19 other tech, auto, medical, defense, and other business and labor groups – today in a letter urged Congress to enact funding for the semiconductor manufacturing, research, and design initiatives
Study finds that anchoring manganese selenide nanoparticles, an anode material, in 3D carbon nanosheets prevents their expansion in lithium-ion batteries.
Northwestern University researchers have developed a new framework using machine learning that improves the accuracy of interatomic potentials — the guiding rules describing how atoms interact — in new materials design.
Pressure-based Mass Flow Controllers for Semiconductor Processing
Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.
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