FPGA Market Worth $9.1 Billion by 2026

Increase in global adoption of AI and IoT, and rising deployment of data centers and high-performance computing are among the factors driving the growth of the FPGA market.

Pfeiffer Vacuum Introduces the Reliable and Low-Vibration HiPace 80 Neo Turbopump

Pfeiffer Vacuum presents its new HiPace 80 Neo turbopump, which features a longer life before service and reduced vibration and noise emissions.

Transphorm Announces the Close of JV Transaction for Acquisition of AFSW Wafer-Fab

Transphorm, Inc. announced today the close of the transaction for the acquisition of 100% interest in the Company’s AFSW wafer-fab facility by GaNovation, Transphorm’s recent joint venture with Palo Alto-based JCP Capital, a new strategic-financial partner.

Heterogeneous Epitaxy of Semiconductors Targeting the Post-Moore Era

A research team led by Prof. LIU Zhiqiang from the Institute of Semiconductors of the Chinese Academy of Sciences, in cooperation with the team led by Prof. GAO Peng from Peking University and the team led by Prof. LIU Zhongfan from Beijing Graphene Institute (BGI), recently realized the concept of “heterogeneous epitaxy” via a van der Walls strategy, a type of nonsymmetrical epitaxy process.

New Material Offers Ecofriendly Solution to Converting Waste Heat into Energy

A team of scientists from Northwestern University and Seoul National University in Korea now has demonstrated a high-performing thermoelectric material in a practical form that can be used in device development.

In-line Airborne Particle Sensing – A Streamlined Contamination Solution for Cleanroom Environments

The IPS relieves pains of traditional monitoring methods while simultaneously increasing tool time and improving yields.

Intel Accelerates Process and Packaging Innovations

Intel Corporation this week revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond.

IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year

A 21% jump would be the largest increase in IC unit shipments since the boom year of 2010.

Merck Launches New Green Solvents for Photoresist Removal in Chip Production

Merck today announced the launch of a new line of complementary green solvents for use in photolithographic processes in semiconductor manufacturing.

CVD Completes the Sale of its 555 North Research Place Facility

CVD Equipment Corporation today announced it closed on the sale of its facility located at 555 North Research Place, Central Islip, New York for the purchase price of $24,360,000.

Covalent Metrology Expands Analytical Chemistry Capabilities with Triple-Quadrupole Inductively Coupled Plasma Mass Spectrometry

Covalent Metrology announces an expansion of its chemical analysis capabilities with the install of a Thermo Scientific iCAP TQ for inductively coupled plasma mass spectroscopy (ICP-MS)

Mobix Labs Introduces Ultra-Wideband mmWave 5G Beamformer

Mobix Labs Inc. today introduced its MBX10 True5G mmWave beamformer AIP (antenna-in-package) and its MIC600 single-chip, single-die beamformer IC (integrated circuit) that deliver ultra-wideband performance from 24.25 – 43.5 GHz.

Boston Start-up JETCOOL Technologies Inc. Offers Solution to the Global Semiconductor Chip Shortage

The semiconductor chip shortage wreaking havoc on the automotive and tech industries is forecasted to reach into 2023.

Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump

The new pumps in the HiScroll ATEX range meet the requirements of the European directive 2014/34/EU.

Micron Launches World’s First 176-Layer NAND in Mobile Solutions

Micron Technology, Inc. announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution.

ZEISS Applies Artificial Intelligence to 3D X-ray Microscope Reconstruction Technologies

Two new reconstruction technologies introduced today by ZEISS use Artificial Intelligence (AI) to improve data collection and analysis, and speed up decision-making significantly.

Kyocera Celebrates 50 Years of U.S. Manufacturing

The City of San Diego has honored Kyocera International, Inc. for 50 years of U.S. manufacturing.

AKHAN Semiconductor Fabricates First of its Kind 300mm Diamond Wafer

AKHAN Semiconductor showcased the ability to manufacture 300mm complementary metal–oxide–semiconductor (CMOS) diamond wafers.

Brooks Instrument Opens New Manufacturing, Service and Applications Support Center in Korea

New location expands Brooks Instrument’s production, service and applications engineering capabilities, providing enhanced support to key customers in the region.

Silicon Wafer Shipments Reach New High in Second Quarter 2021

Worldwide silicon wafer area shipments increased 6% to 3,534 million square inches in the second quarter of 2021, surpassing the historical high set in the first quarter.

Wooptix Introduces Wafer Geometry System for 300mm Blank Silicon Wafers

Wooptix SL, a Spanish company dedicated to developing new imaging solutions, has introduced Phemet® lab system, a 300mm blank silicon wafer geometry system collecting millions of topography data points on a full wafer in a few seconds.

While Industry Booms, China Worries Mount

While China’s share of all semiconductor production has shot up, the Americas region has declined, raising alarm bells in Washington. “We see a continuation of this trend, with the Americas dropping by one more percent point next year and China building out its lead.” – SEMI senior principal analyst Christian Dieseldorff.

Blaize Announces $71M Series D Financing to Further Accelerate Growth

Blaize, the AI computing innovator revolutionizing edge and automotive computing solutions, today announced the close of a $71m Series D round of funding.

Pressure-based Mass Flow Controllers for Semiconductor Processing

Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.

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august

202104augAll Day05FeaturedAdvancements in Thermal Management - Virtual(All Day) VIRTUAL CONFERENCE

202109augAll Day12SiP — Advanced System in Package Technology - Virtual(All Day) VIRTUAL CONFERENCE

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october

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