EUVL Masks may need to be Tool-Specific

Extreme Ultra-Violet Lithography (EUVL) keeps hurting my brain. Just when I can understand how it could be used in profitable commercial high-volume manufacturing (HVM) I hear something that seriously strains my brain. First it was the mirrors and mask in…

Patterning with Films and Chemicals

Somewhere around 40nm is the limit on the smallest half-pitch feature that can be formed with a single-exposure of 193-nm wavelength laser light using water immersion (193i) lithography. While multiple-patterning (MP) is needed to achieve tighter half-pitches, smaller features at…

SAQP Specs for 7nm finFETs

As discussed in my last Ed’s Threads, lithography has become patterning as evidenced by first use of Self-Aligned Quadruple Patterning (SAQP) in High Volume Manufacturing (HVM) of memory chips. Meanwhile, industry R&D hub imec has been investigating use of SAQP…

Litho becomes Patterning

Once upon a time, lithographic (litho) processes were all that IC fabs needed to transfer the design-intent into silicon chips. Over the last 10-15 years, however, IC device structural features have continued to shrink below half the wavelength of the…

ASML Books Production EUV Orders

TSMC commits to two tools for delivery next year Maybe, just maybe, ASML Holding N.V. (ASML) has made the near-impossible a reality by creating a cost-effective Extreme Ultra-Violet (EUV @ ~13.5nm wavelength) all-reflective lithographic tool. The company has announced that…