The next phase for Industry 4.0 initiatives will be to aggregate ML models to provide fab-wide predictions such as Wafer Acceptance Testing.
The role of cryogenic wafer probing in applications such as cryogenic quantum computing and supra-conductive CMOS semiconductors, where temperatures near absolute zero are essential, is discussed.
Areas ideally suited for AI applications may be repetitive and mental labor-intensive tasks with good available data, or when analytical methods are not applicable or too difficult to find, or data interpolation.
An AI-powered camera using a dedicated co-processor chip with innovative deep learning algorithms can deliver a vision-based solution with unmatched performance, power efficiency, cost-effectiveness, and scalability.
The Data-Centric Era is here. It demands highly flexible, high bandwidth and secure infrastructure to meet the demands of highly variable, large and diverse data. Composable infrastructure provides the flexibility, bandwidth and efficiency to meet that demand.