Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap

At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.

Sony, Samsung, Toshiba, Toppan Have Image Sensor/LiDAR Papers at the VLSI Symposia in June

Since the development of mobile phone camera image sensors, they have been a hot topic with continuous evolution to sub-micron pixels, and more recently the move towards self-driving cars (and other ranging needs) is pushing LiDAR systems.