What’s in the July Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July issue. If you are at SEMICON West, stop by Booth 1733 and pick up a copy in print.

In this Issue:

EDITORIAL: The Critical Infrastructure

NEWS

METROLOGY: Emerging Metrology Requirements for Heterogeneous Integration and 3D Packaging

LOGIC: Scaling Progress Takes Many Paths at VLSI Symposium

BUSINESS: CHIPS and FABS Acts: the Road Ahead

SUPPLY CHAIN: Shortages of Equipment, Design Engineers, Face Booming Semiconductor Industry

METROLOGY: New Wafer-like and Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber

EDA: The Democratization of Chip Design

POLICY: A Holistic Approach to Strengthening the Semiconductor Supply Chain

METROLOGY: Backed by Mass Spectrometry: Keeping Up with Increased Demand for Semiconductors

POLICY: Re-Shoring Advanced Semiconductor Packaging Innovation, Supply Chain Security, and U.S. Leadership in the Semiconductor Industry

METROLOGY: Thin Film Thermal Metrology and Its Implications for Electronic Devices

INDUSTRY OBSERVATION: Why the U.S. Needs to Bring Significant Transforming U.S. Microelectronics Manufacturing Leadership Through New Advanced Packaging Techniques