Intel Updates Advanced Packaging Technologies at SEMICON West Part 2

At the Architecture Day Intel demoed a Foveros-based part, comprising a high-performance 10-nm chiplet on a low-power 22nm base die. The upper die contained five cores, four Atom low-power cores and a high-performance core, and as shown in the Intel image above, the two lower dies were stacked with PoP memory, all in a 12 x 12 mm package with 2mW standby power.

Light and Sound In Silicon Chips: The Slower The Better

Integrated circuits in silicon enable our digital era. The capabilities of electronic circuits have been extended even further with the introduction of photonics: components for the generation, guiding and detection of light. Together, electronics and photonics support entire systems for data communication and processing, all on a chip. However, there are certain things that even electrical and optical signals can’t do simply because they move too fast.

Paramagnetic Spins Take Electrons for a Ride, Produce Electricity From Heat

An international team of researchers has observed that local thermal perturbations of spins in a solid can convert heat to energy even in a paramagnetic material – where spins weren’t thought to correlate long enough to do so. The research team includes scientists from North Carolina State University, the Department of Energy’s Oak Ridge National Laboratory (ORNL), the Chinese Academy of Sciences and the Ohio State University.

Semiconductor Industry Veteran Bee Bee Ng New SEMI Southeast Asia President

SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that semiconductor industry veteran Bee Bee Ng has joined SEMI as president of SEMI Southeast Asia, reporting to SEMI CFO Richard Salsman. Based in Singapore, Ng will direct SEMI Southeast Asia sales and services; expositions and programs including standards, EHS, workforce development and advocacy; and administrative operations.