The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ASIC and SoC Design Partner Rebrands as Aion Silicon
Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today officially unveiled its new name, vision, and leadership team.
ROHM Develops New High Power Density SiC Power Modules
ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles).
Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance
Aion Silicon (formerly Sondrel) today announced it has joined the Intel Foundry Accelerator Design Services Alliance.
ChEmpower Secures $18.7M to Advance Abrasive-Free Planarization in Chip Manufacturing
New investment to drive sustainability in advanced AI chip manufacturing.
Microchip Unveils New High-Density Power Module for AI at the Edge Applications
AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications.
M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), today announced that its eUSB2 PHY IP has achieved silicon-proven status on TSMC’s 3nm process and has successfully completed tape-out on TSMC’s 2nm process.
Holography Innovator VividQ Opens U.S. Headquarters in Silicon Valley
VividQ, a deep technology innovator in computational holography, today announced the opening of its first U.S. headquarters in Palo Alto, California and the appointment of veteran tech executive Mark Morrison as Vice President of Sales.
Advanced Chip Packaging/Microsystems Breakthroughs to be Presented at Upcoming IEEE ECTC Conference
The IEEE Electronic Components and Technology Conference (ECTC) is the world’s premier conference and product exhibition for bringing together the best in chip packaging, components, and microelectronic systems in an environment of cooperation and technical exchange.
