Energy consumption from artificial intelligence could be reduced by a factor of at least 1,000 with this device.
AMI Joins NXP Semiconductors Partner Program
AMI announced that it has formally joined the NXP Semiconductors Partner Program.
Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced today it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.
Fractile Raises $15M Seed Funding
Fractile, a UK company building a groundbreaking new AI chip to deliver exponential performance improvements for AI models, has today exited stealth and announced $15m (£12m) in seed funding.
IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory
Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules.
Analog Devices and Flagship Pioneering Announce Strategic Partnership
Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Flagship Pioneering, the bioplatform innovation company, today announced a strategic alliance to accelerate the development of a fully digitized biological world.
IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees
2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
Dr. Chandrasekaran succeeds retiring Keyvan Esfarjani as chief global operations officer.
Boston Semi Equipment Launches New Test Site Module for Zeus Test Handler to Support Power IC Manufacturers
Boston Semi Equipment (BSE) today introduced a new test site module for its Zeus gravity feed test handler to support high-voltage and partial discharge (HVPD) applications in power electronics manufacturing.
Pusan National University Researchers Explore the Interplay Between High-Affinity DNA and Carbon Nanotubes
Researchers demonstrate the intricate interactions between single-stranded DNA sequences and carbon nanotubes.
