ZEISS Semiconductor Mask Solutions has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award. The PQS Award recognizes companies like ZEISS that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism.
Plessey Extends its Data-Vµ MicroLED Product Family with a Passive Matrix Micro-Display
Plessey, an embedded technologies developer at the forefront of microLED technology for augmented and mixed reality (AR/MR) display applications, has added passive matrix microLED displays to its Data-Vµ product family.
A Small Step for Atoms, a Giant Leap for Microelectronics
Step by step, scientists are figuring out new ways to extend Moore’s Law. The latest reveals a path toward integrated circuits with two-dimensional transistors. A Rice University scientist and his collaborators in Taiwan and China reported in Nature today that they have successfully grown atom-thick sheets of hexagonal boron nitride (hBN) as two-inch diameter crystals across a wafer.
Samsung Executive Joins Si2 Board of Directors
Jung Yun Choi, corporate vice president for the Samsung Electronics Design Technology team, has been elected to the Silicon Integration Initiative board of directors. A 17-year Samsung veteran, Choi leads the team responsible for developing all design tools and methodologies for Samsung memory products: technologies and environments impacting product values, new process and package technologies, new applications and new working environments such as the Cloud.
SK Siltron Completes Acquisition of U.S. DuPont’s SiC Wafer Division
SK Siltron, a global maker of semiconductor wafers, announced today it has completed the acquisition of DuPont’s Silicon Carbide Wafer (SiC Wafer) unit. The acquisition was decided through a board meeting in September and closed on February 29.
Integra Technologies Enhances Test Services with Presto Engineering Partnership
Integra Technologies, a global provider of semiconductor services for high reliability applications, announced today a partnership with Presto Engineering’s, San Jose, Calif.-based hub, a provider of test and qualification services to the radiofrequency (RF) market in the U.S. Integra and Presto Engineering have entered into an agreement whereby Presto will consign its existing RF test equipment set, located in its San Jose, Calif. facility, to Integra Technology’s Milpitas, Calif. location.
CEVA Unveils World’s Most Powerful DSP Architecture
CEVA, Inc., a licensor of wireless connectivity and smart sensing technologies, today announced the unveiling of the world’s most powerful DSP architecture, the Gen4 CEVA-XC. This new architecture delivers unmatched performance for the most complex parallel processing workloads required for 5G endpoints and Radio Access Networks (RAN), enterprise access points and other multigigabit low latency applications.
SEMICON Southeast Asia 2020 Postponed to August 2020
SEMI announced today that it is postponing SEMICON Southeast Asia 2020, the region’s premier event for the global electronics manufacturing supply chain, from 12-14 May 2020 to 11-13 August 2020. The postponement is due to concern surrounding the ongoing international coronavirus (COVID-19) outbreak. The venue for SEMICON Southeast Asia 2020 will remain the Malaysia International Trade and Exhibition Centre (MITEC).
BISTel Announces First Cloud Capable, A.I. Powered FDC System for Semiconductor Manufacturing
BISTel, the leading supplier of engineering automation and manufacturing A.I. applications announced today the semiconductor industry’s first cloud capable, A.I. powered, fault detection and classification system (FDC). The new FDC solution, called Dynamic Fault Detection (DFD) in the cloud, offers chipmakers a more comprehensive method for detecting faults.
Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes
Lam Research Corp. today announced the launch of a completely transformed plasma etch technology and system solution, designed to provide chipmakers with advanced functionality and extendibility required for future innovation. Lam’s groundbreaking Sense.i platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity, supporting logic and memory device roadmaps through the coming decade.
