Synopsys, Inc. (Nasdaq: SNPS) today announced that TSMC has certified Synopsys’ digital and custom design platforms for TSMC’s 3-nanometer (nm) process technology. This certification, based on TSMC’s latest design rule manual (DRM) and process design kits (PDKs), is the result of an extensive collaboration with rigorous validation to deliver design solutions for optimized power, performance, and area (PPA), which accelerate the path to next-generation designs.
Battery Life for Wearable Electronic Devices Could Be Improved
Researchers in WMG and the Department of Physics at the University of Warwick have found that asymmetric stresses within electrodes used in certain wearable electronic devices provides an important clue as to how to improve the durability and lifespan of these batteries.
Alchip Technologies Reveals Secrets Behind Reticle Size Design
Alchip Technologies today revealed the trials, tribulation and victories inherent in the production of huge reticle-size processors that power today’s most advanced supercomputers.
Roger Grace Associates Announces Call for Participation in its Annual MEMS Industry Commercialization Report Card Study
Roger Grace, President of Roger Grace Associates, the leading marketing consultancy specializing in Sensors and MEMS, has announced the call for participation in the 21st. Annual MEMS Industry Commercialization Report Card Study.
Marvell and TSMC Collaborate to Deliver Industry’s Most Advanced Data Infrastructure Portfolio on 5nm Technology
With this collaboration, Marvell and TSMC are advancing the essential technology underpinning this infrastructure to provide the storage, bandwidth, speed, and intelligence that tomorrow’s digital economy demands.
SEMI Statement on New U.S. Export Control Regulations
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement in response to the new export control rule changes announced by the United States Commerce Department.
Scientech Corporation and Trymax Partner to Distribute Resist Ashing and UV Products in Taiwan
Trymax Semiconductor Equipment BV, a global leader in semiconductor plasma technology, and Scientech Corporation, announced today that they have entered into a distribution agreement for Taiwan. The agreement gives Scientech Corporation the right to distribute all of Trymax’s NEO ashing, etching products and their latest UV curing and charge erase products.
Sensata Technologies Appoints New General Manager for Aftermarket Business Unit
Sensata Technologies, a global industrial technology company and a leading provider of sensor-rich solutions, is pleased to announce the appointment of Russ Stebbins as General Manager of the Global Aftermarket Business Unit. Russ’s appointment plays a critical role in supporting Sensata’s continual growth strategy and driving its leadership position in the automotive aftermarket.
High-Function Polyol Additives Improve Performance of Electronics Adhesives
Adhesives used in electronics assemblies must perform without fail to protect delicate components from vibration and heat. They must also be able to secure the components without interfering with the operation of the end product.
Monzukuri Unveils First Commercially-Available IC/Package Co-Design Tool
Monozukuri S.p.A, today unveiled GENIO, the first commercially available IC/Package Co-Design Tool. The company said that it is able to take orders for GENIO now. GENIO is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.
