Kulicke and Soffa Industries, Inc. announced the launch of Asterion-PW, extending its leadership in power device applications with a fast and precise ultrasonic pin welding solution. This advanced solution sets a new standard for pin interconnect capability – redefining efficiency, precision, and reliability.
Power module devices currently deployed in renewable energy, automotive, and railroad applications are increasingly reliant on pin-based interconnects for critical power storage, management and delivery requirements. The Power module market is one of the fastest growing semiconductor markets – anticipated to support a 12% compound annual growth rate through 2029.
The Asterion-PW leverages market leading ultrasonic technology which is replacing traditional soldering in crucial applications due to accuracy and productivity improvements. Additionally, due to the elimination of flux and solder paste, the Sonotrode ultrasonic capability provides clear environmental benefits. The Asterion-PW platform also provides unparalleled speed and precision enabling higher throughput and superior quality:
- Unmatched Speed and Precision: With a high-resolution linear motor positioning system and innovative, patent-pending Sonotrode design, the Asterion-PW achieves fine precision Pin placement repeatability.
- Enhanced Productivity: An integrated high speed bulk pin feeder system and optional material handling system equipped with an advanced cleaning station ensure smooth operation. The cleaning system effectively removes contaminants before encapsulation, improving product quality.
- Superior Cost of Ownership: The durable Sonotrode boasts one of the longest operational lifespans currently known in the industry, delivering less frequent change overs, outstanding reliability and cost efficiency.
“Precision drives innovation, and innovation transforms possibilities into realities. The Asterion-PW for Power module applications is where innovative technology meets performance and cost of ownership benefits, redefining the future of manufacturing,” said Chan Pin Chong, Kulicke & Soffa’s Executive Vice President and General Manager of Products and Solutions.
ATPremier MEM PLUS – new K&S Vertical Wire solutions to serve high-volume memory
K&S has separately announced the concurrent launch of ATPremier MEM PLUS, a cutting-edge wafer level packaging solution, which deploys innovative Vertical Wire technology positioned to support emerging advanced memory applications.
