VividQ, a deep technology innovator in computational holography, today announced the opening of its first U.S. headquarters in Palo Alto, California and the appointment of veteran tech executive Mark Morrison as Vice President of Sales.
Advanced Chip Packaging/Microsystems Breakthroughs to be Presented at Upcoming IEEE ECTC Conference
The IEEE Electronic Components and Technology Conference (ECTC) is the world’s premier conference and product exhibition for bringing together the best in chip packaging, components, and microelectronic systems in an environment of cooperation and technical exchange.
Siemens Collaborates with TSMC to Drive Further Innovation in Semiconductor Design and Integration
Siemens Digital Industries Software today announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
Showcasing TSMC’s latest offerings for high performance computing, smartphone, automotive, and IoT applications.
BrainChip Extends RISC-V Reach with Andes Technology Integration
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, brain-inspired AI, today announced the integration of its NPUs with RISC-V cores from Andes Technology, a provider of RISC-V embedded cores.
Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
Synopsys, Inc. announced today its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC’s most advanced processes and advanced packaging technologies to accelerate AI chip design and 3D multi-die design innovation.
Nearly $2M in State Grants, New Programs Will Advance Semiconductor Education at Washtenaw Community College
Nearly $2 million in grants at Washtenaw Community College (WCC), along with new associate degree and certificate programs, will advance Michigan’s mobility sector through semiconductor and battery education and training.
The Northeast Microelectronics Coalition Announces $1.43 Million to 19 Semiconductor Companies
The Northeast Microelectronics Coalition (NEMC) Hub today announced $1,432,373 in awards to 19 startups and small businesses through its Powering Regional Opportunities for Prototyping Microelectronics (PROPEL) Operations Program.
Brain-Inspired AI Breakthrough: Making Computers See More Like Humans
A team of researchers from the Institute for Basic Science (IBS), Yonsei University, and the Max Planck Institute have developed a new artificial intelligence (AI) technique that brings machine vision closer to how the human brain processes images.
xMEMS Labs Powers World’s First AI Sports Glasses with Cowell MEMS Tweeter
xMEMS Labs, Inc. today announced that its Cowell MEMS tweeter is now shipping in a groundbreaking AI sports glasses product from BleeqUp, a hardware startup based in China.
