Fractile, a UK company building a groundbreaking new AI chip to deliver exponential performance improvements for AI models, has today exited stealth and announced $15m (£12m) in seed funding.
IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory
Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules.
Analog Devices and Flagship Pioneering Announce Strategic Partnership
Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Flagship Pioneering, the bioplatform innovation company, today announced a strategic alliance to accelerate the development of a fully digitized biological world.
IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees
2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
Dr. Chandrasekaran succeeds retiring Keyvan Esfarjani as chief global operations officer.
Boston Semi Equipment Launches New Test Site Module for Zeus Test Handler to Support Power IC Manufacturers
Boston Semi Equipment (BSE) today introduced a new test site module for its Zeus gravity feed test handler to support high-voltage and partial discharge (HVPD) applications in power electronics manufacturing.
Pusan National University Researchers Explore the Interplay Between High-Affinity DNA and Carbon Nanotubes
Researchers demonstrate the intricate interactions between single-stranded DNA sequences and carbon nanotubes.
Chiplet Summit to Focus on New Packages and AI Applications in 2025
Chiplet Summit announces its third annual event on January 21-23 at the Santa Clara Convention Center. The 2025 meeting focuses on a new level in chip design: system-in-package (SiP).
SiMa.ai and Ortecs Announce Agreement to Deliver Edge AI Technology in Israel
Through its partnership with SiMa.ai, Ortecs will expand its portfolio and provide its customers and the market in Israel with a new artificial intelligence offering.
KIOXIA Honored by FMS With Lifetime Achievement Award for 3D NAND Flash Invention
KIOXIA, the inventor of NAND flash memory, is the recipient of the FMS: the Future of Memory and Storage Lifetime Achievement Award for 2024.
