New cleanroom equipment creates ideal space for students to learn advanced packaging processes.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
SK hynix Inc. announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Aspinity Establishes Technical Advisory Board
Aspinity today announced the formation of its technical advisory board, including Kymeta President and CEO Rick Bergman and Boston Consulting Group (BCG) Advisor Bill Earnshaw.
Nordson Electronics Solutions Expands the SELECT Synchro Selective Soldering Equipment Family
Nordson Electronics Solutions releases the Synchro 3, a new model in the SELECT Synchro selective soldering equipmen family for high-volume printed circuit board assembly applications.
Empower Semiconductor Announces European Sales Expansion
Empower Semiconductor today announced a representation and distribution agreement with Dimac Red Spa.
Chemistry Researchers Modify Solar Technology to Produce a Less Harmful Greenhouse Gas
Researchers in the UNC-Chapel Hill Chemistry Department are using semiconductors to harvest and convert the sun’s energy into high-energy compounds that have the potential to produce environmentally friendly fuels.
Henkel Semiconductor Capillary Underfill Enables AI and Advanced Packaging Designs
Henkel today announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications.
NY CREATES and C2MI Announce Partnership
NY CREATES and MiQro Innovation Collaborative Centre – C2MI today announced a partnership between the two entities that will enhance research opportunities, expand potential for economic and workforce development, and nurture collaborative efforts.
Hailo Closes New $120 Million Funding Round and Debuts Hailo-10
Hailo’s funding now exceeds $340 million as the company introduces its newest AI accelerator specifically designed to process LLMs at low power consumption for the personal computer and automotive industries, bringing generative AI to the edge.
Old Crystal, New Story for Enhancing Deep Ultraviolet Laser Performance
In the realm of science and technology, harnessing coherent light sources in the deep ultraviolet (DUV) region holds immense significance across various applications such as lithography, defect inspection, metrology, and spectroscopy.
