SEALSQ Corp. today announces a strategic collaboration with IC’ALPS, a ASIC design house specializing in custom integrated circuits ready for IATF16949 standard, mastering Functional Safety for ISO 26262 with solutions tailored to meet the required ASIL levels.
xMEMS Introduces Lassen, its First “Amplifier-less” High-Performance Silicon MEMS Tweeter Speaker
xMEMS Labs today announced xMEMS Lassen, the company’s newest innovation for delivering micro fidelity (µFidelity) audio to mass-market consumer earbuds.
Pragmatic Semiconductor Set to Revolutionize NFC Connectivity with Sustainable Flexible Chips
Pragmatic Semiconductor Ltd. today announced the launch of its latest radio frequency identification (RFID) near-field communication (NFC) product line, Pragmatic NFC Connect.
Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels
Toray Engineering Co., Ltd. has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging.
Kulicke & Soffa Introduces Asterion-PW for Power Semiconductor Applications
Kulicke and Soffa Industries, Inc. announced the launch of Asterion-PW, extending its leadership in power device applications with a fast and precise ultrasonic pin welding solution.
Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design
Silvaco Group, Inc. today announced that Faraday Technology Corporation has selected Silvaco’s FlexCAN IP to establish a robust networking backbone for its latest automotive ASIC design.
Veijo Kontas Joins proteanTecs Advisory Board
A veteran of the semiconductor and wireless industries, Kontas brings decades of expertise in SoC development to support proteanTecs’ strategic growth in telecommunications.
FTD Solutions Announces Partnership with CEA-Leti
Collaboration focuses on water conservation and sustainable semiconductor manufacturing.
TECHCET Projects 5.9% Growth in CMP Consumables for 2025
TECHCET forecasts a 6% increase in CMP Consumables revenue for 2025, driven by advances in memory and logic chips.
Roy Furbank Appointed Chief Technology Officer
Hemlock Semiconductor (HSC), a producer of hyper-pure polysilicon for the semiconductor and solar industries, today announced that Vice President of Process Engineering Roy Furbank has been appointed Chief Technology Officer (CTO).
