Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it signed a Memorandum of Cooperation with Quest Global Services PTE. Ltd.
Heraeus Covantics Unveils Manufacturing Plant in Shenyang, China
Heraeus, a global technology group, celebrated the official launch of its new Heraeus Covantics plant in Shenyang, northeast China.
Global Fab Equipment Investment Expected to Reach $110 Billion in 2025
Global fab equipment spending for front-end facilities in 2025 is anticipated to increase by 2% year-over-year (YoY) to $110 billion, marking the sixth consecutive year of growth since 2020, SEMI announced today in its latest quarterly World Fab Forecast report.
ULVAC Developing Next-Generation Dilution Refrigerator for Quantum Computing by 2026
ULVAC, Inc. and ULVAC CRYOGENICS INC. announced that they are developing a next-generation dilution refrigerator for quantum computers with input from IBM.
Researchers Develop Novel Biomimetic Fabrication Technique for Flexible Electronics Such as Wearable Sensors and Electronic Skins
A research team at the University of Turku, Finland, has developed an innovative approach to replicating bioinspired microstructures found in plant leaf skeletons, eliminating the need for conventional cleanroom technologies.
Researchers Using Lidar and AI to Advance Transportation Engineering and Safety
University of Missouri engineering researchers are using advanced technology to help make our roads safer by better understanding how pedestrians, cyclists and vehicles interact.
Cycuity Collaborates with SiFive and BAE Systems to Demonstrate Advanced Microelectronics Design Supply Chain Security
Cycuity has collaborated with SiFive and BAE Systems to deliver increased, evidence-based security assurance for third-party intellectual property (IP) in a cost-effective and repeatable manner.
New Ultra-Low Alpha Tin Plating Solutions Tackle Soft Errors in Shrinking Semiconductor Devices to Deliver Semiconductor Reliability
MacDermid Alpha Electronics Solutions, a supplier of integrated materials and chemistry for the electronics industry, unveiled its new product range ‘Low Alpha Tin’ – innovative technology designed to address the growing problem of soft errors caused by alpha emissions in next-generation semiconductors.
Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
Today, Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member.
SK hynix Ships World’s First 12-Layer HBM4 Samples to Customers
SK hynix Inc. announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.
