Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures.
AI Chip Deals Remain Low; Chip Makers Take Over as Major Buyers, Reveals New Omdia Research
With demand for AI chips soaring, Omdia’s AI Processors Mergers & Acquisitions Tracker has revealed that AI chip deals remain low and that chip manufacturers are taking over as the major buyers.
Sony Semiconductor Israel Announces Commercial Availability of the Revolutionary ALT1350 LPWA Chipset
The new ALT1350, a game-changer for asset trackers and smart utility meters, boasts unmatched low power consumption and advanced location capabilities.
UC San Diego and CEA-Leti Report First IC for Piezoelectric Resonator DC-DC Conversion Achieving a 310% Loss Reduction
University of California San Diego and CEA-Leti scientists have developed a ground-breaking piezoelectric-based DC-DC converter that unifies all power switches onto a single chip to increase power density.
Samsung Electronics Collaborates with Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry’s Latest GAA Process Technology
Collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.
Aerotech Invests in Korean Manufacturing Facility
Aerotech Inc., a global leader in precision motion control and automation, is expanding its partnership with Korean distributor ANI Motion Tech.
TECHCET Welcomes Mike Walden as New Senior Director
TECHCET announced Mike (Michel) Walden as the new Senior Director of Market Research and Analytics for TECHCET.
Efabless Announces the Inaugural Chipalooza Analog and Mixed-Signal Design Challenge
Efabless Corporation, the creator platform for chips, is excited to announce the launch of the first Chipalooza Analog and Mixed-Signal Design Challenge, an innovative competition aimed at engineers and designers around the globe.
Researchers Invent New Way to Stretch Diamond for Better Quantum Bits
A future quantum network may become less of a stretch, thanks to researchers at the University of Chicago, Argonne National Laboratory and Cambridge University.
SIA Commends CHIPS Act Incentives for GlobalFoundries Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
