NXP Semiconductors N.V. today announced an extension of its automotive radar one-chip family.
New Omdia Research Finds Display Fab Utilization Forecast is Down to 68% in the First Quarter of 2024
Owing to slower demand early in the year in 2024 along with panel makers’ efforts for LCD panel price protection, Omdia forecasts say display fabs’ overall utilization will lower below 68% in 1Q24.
Hailo Showcases the Future of Edge AI at CES 2024
The company’s advanced Hailo-15 and Hailo-8 AI processors hold the key to secure, reliable, next-generation solutions by bringing cloud processing capabilities to the edge.
Using Berry Phase Monopole Engineering for High-Temperature Spintronic Devices
Spintronic devices are electronic devices that utilize the spin of electrons (an intrinsic form of angular momentum possessed by the electron) to achieve high-speed processing and low-cost data storage.
Electronic System Design Industry Posts Record $4.7 Billion in Revenue in Q3 2023, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 25.2% to $4,702.4 million in the third quarter of 2023 from the $3,756.3 million logged in the third quarter of 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Industry Strategy Symposium 2024 Opens to Highlight Semiconductor Growth Opportunities on Path to $1 Trillion
Semiconductor industry growth opportunities in the year ahead will take center stage at Industry Strategy Symposium (ISS) 2024 as the year’s first executive check-in opens today with leading analysts, researchers, economists, and technologists offering insights on forces impacting the industry.
OMNIVISION Announces Single Chip LCOS Panel for Next-Generation Smart AR/XR/MR Glasses
OMNIVISION, a global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, today announced the new OP03050, a low-power, small form factor liquid crystal on silicon (LCOS) panel that integrates the LCOS array, driving circuit, framebuffer and interface in a single chip.
TI Debuts New Automotive Chips at CES
Texas Instruments today introduced new semiconductors designed to improve automotive safety and intelligence.
National Semiconductor and Advanced Manufacturing Technician Apprenticeship Program Launched to Support State Efforts to Develop Strategic Talent Pipelines
Today the National Institute for Innovation and Technology—the nation’s leader in the semiconductor talent pipeline development and U.S. Department of Labor (USDOL) national Intermediary responsible for establishing and expanding Registered Apprenticeships (RAs) throughout semiconductor and nanotechnology-related industry supply chains—launched the national Semiconductor and Advanced Manufacturing Technician Apprenticeship Program (SAM-TAP).
TDK Ventures Invests in Silicon Box and its Chiplet Technology
TDK Corporation announced today that subsidiary TDK Ventures, Inc. has invested in Singaporean tech disruptor Silicon Box and its innovative semiconductor chiplet packaging design and fabrication capabilities, which offers newfound standards in performance and scale.
