This significant milestone is pivotal in reinforcing Scintil’s supply chain and meeting growing demand for high-performance communication solutions in data centers, artificial intelligence (AI) and 5G networks.
EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test and fabricate new circuits from across Europe.
Imec Demonstrates Readiness of the High-NA EUV Patterning Ecosystem
Advances in processes, masks and metrology will enable to fully benefit from the resolution gain offered by the first ASML 0.55NA EUV scanner.
Finwave Semiconductor Showcases Breakthrough Performance Advancement with GaN-on-Silicon Technology at MWC Barcelona 2024
Finwave Semiconductor, Inc. is showcasing its latest technology and products this week at MWC Barcelona.
National Institute for Innovation and Technology Hosts Arizona Semiconductor Panel Discussion
Institute’s panel brought together key stakeholders for panel discussion on workforce development in growing semiconductor manufacturing industry, highlights the City of Phoenix’s efforts.
SAPEON Collaborates with DOCOMO Innovations
SAPEON, a global AI semiconductor company, announced their partnership with DOCOMO Innovations, INC. based in Silicon Valley, a subsidiary of Japan’s largest mobile operator, NTT DOCOMO, INC.
Intel Announces New Edge Platform for Scaling AI Applications
The edge-native software platform simplifies development, deployment and management of edge AI applications.
Enhancing Electrogenerated Chemiluminescence of an Iridium Complex
Researchers develop electrogenerated chemiluminescence cells that possess unprecedented levels of luminance and current efficiency.
Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI
Micron Technology, Inc. today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution.
U.S. Department of Energy Announces $2.25 Million American-Made SiC Semiconductor Prize Competition
The U.S. Department of Energy’s (DOE) Office of Electricity (OE) today launched the American-Made Silicon Carbide (SiC) Semiconductor Packaging Prize.
